Patents by Inventor Dhanushkodi Durai Mariappan

Dhanushkodi Durai Mariappan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240068974
    Abstract: A method for identifying damage in a component of a wind turbine includes placing a conductive element onto at least one surface of the component of the wind turbine. The method also includes electrically connecting the conductive element into an electrical circuit. Further, the method includes monitoring a status of the electrical circuit to identify the damage in the component. In particular, when the status of the electrical circuit is open, damage is likely present in the component, and when the status of the electrical circuit is closed, damage is unlikely present in the component. Moreover, the method includes transmitting the status of the electrical circuit to a user interface for display.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Daniel Edward Jordy, Bhaveshkumar Mahendrakumar Kachhia, Aaron Lee Sprague, Dhanushkodi Durai Mariappan, William Max Gobeli
  • Patent number: 11773963
    Abstract: A gear system includes a carrier having a first portion and a separate, second portion and a plurality of pin shafts extending from the first portion of the carrier. Each of the plurality of pin shafts includes a first end and a second end. As such, the first ends are integrally formed with the first portion of the carrier. The first and second portions are arranged on opposing sides of the plurality of pin shafts and are spaced apart such that the first and second portions do not contact each other. Further, the second portion of the carrier defines an end plate that is secured to the second ends of the plurality of pin shafts. The gear system also includes a plurality of gears mounted to the plurality of pin shafts, with each of the plurality of gears arranged so as to rotate around one of the plurality of pin shafts.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: October 3, 2023
    Assignee: General Electric Company
    Inventors: Collin McKee Sheppard, Fulton Jose Lopez, Raed Zuhair Hasan, Dhanushkodi Durai Mariappan, Ryan Eric Vogel
  • Publication number: 20210404548
    Abstract: A gear system includes a carrier having a first portion and a separate, second portion and a plurality of pin shafts extending from the first portion of the carrier. Each of the plurality of pin shafts includes a first end and a second end. As such, the first ends are integrally formed with the first portion of the carrier. The first and second portions are arranged on opposing sides of the plurality of pin shafts and are spaced apart such that the first and second portions do not contact each other. Further, the second portion of the carrier defines an end plate that is secured to the second ends of the plurality of pin shafts. The gear system also includes a plurality of gears mounted to the plurality of pin shafts, with each of the plurality of gears arranged so as to rotate around one of the plurality of pin shafts.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 30, 2021
    Inventors: Collin McKee Sheppard, Fulton Jose Lopez, Raed Zuhair Hasan, Dhanushkodi Durai Mariappan, Ryan Eric Vogel
  • Patent number: 10828878
    Abstract: Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 10, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: Sanha Kim, Anastasios John Hart, Piran Ravichandran Kidambi, Dhanushkodi Durai Mariappan
  • Publication number: 20180244027
    Abstract: Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.
    Type: Application
    Filed: February 28, 2018
    Publication date: August 30, 2018
    Inventors: Sanha Kim, Anastasios John Hart, Piran Ravichandran Kidambi, Dhanushkodi Durai Mariappan