Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas feed line having an RPS outlet and a bypass outlet. The systems may include a remote plasma unit supported atop the lid plate. The remote plasma unit may include an inlet and an outlet. The inlet may be coupled with the RPS outlet. The systems may include a center manifold having an RPS inlet coupled with the outlet and a bypass inlet coupled with the bypass outlet. The center manifold may include a plurality of outlet ports. The systems may include a plurality of side manifolds that are fluidly coupled with the outlet ports. Each of the side manifolds may define a gas lumen. The systems may include a plurality of output manifolds seated on the lid plate. Each output manifold may be fluidly coupled with the gas lumen of one of the side manifolds.

Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may include a top surface and side surfaces. The gas splitter may define a first and second gas inlets, with each gas inlet extending through one side surface. The gas splitter may define first and second gas outlets extending through the top surface. The gas splitter may define first and second gas lumens that extend between and fluidly couple each gas inlet with corresponding gas outlets. The gas splitter may define mixing channels that include a mixing outlet extending through a side surface and a mixing inlet extending through the top surface. The systems may include output manifolds seated on the lid plate. The systems may include output weldments that fluidly couple each mixing outlet with a respective one of the output manifolds.

Abstract: The present disclosure relates to a cleaning assemblies, components thereof, and methods associated therewith for substrate processing chambers. In one example, a cleaning assembly for a substrate processing chamber includes a distribution ring. The distribution ring comprises a body with an inlet and an outlet. The outlet is fluidly coupled to an internal volume of the substrate processing chamber via a sidewall of the substrate processing chamber. The cleaning assembly includes a cleaning conduit configured to fluidly couple a gas manifold to the distribution ring for diverting a first portion of cleaning fluid from the gas manifold to the distribution ring.

Abstract: A method of purging a substrate carrier at a load port includes: opening a door of a substrate carrier that is delivered to a load port; spraying the substrate carrier with a gas flow responsive to the opening the door; mapping substrates within the substrate carrier to generate a substrate map; determining a process purge state based on the substrate map; and activating one or more inter-substrate nozzle arrays and one or more curtain nozzle arrays using a predefined spray status configuration for the process purge state.

Abstract: A method of purging a substrate carrier at a load port includes: opening a door of a substrate carrier that is delivered to a load port; spraying the substrate carrier with a gas flow responsive to the opening the door; mapping substrates within the substrate carrier to generate a substrate map; determining a process purge state based on the substrate map; and activating one or more inter-substrate nozzle arrays and one or more curtain nozzle arrays using a predefined spray status configuration for the process purge state.

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for purging a substrate carrier. Embodiments include a frame configured to sit proximate to a load port door without interfering with operation of a factory interface or equipment front end module robot; one or more inter-substrate nozzle arrays supported by the frame and configured to spray gas into a substrate carrier; and one or more curtain nozzle arrays supported by the frame and configured to spray gas across an opening of the substrate carrier. Numerous additional aspects are disclosed.

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for purging a substrate carrier. Embodiments include a frame configured to sit proximate to a load port door without interfering with operation of a factory interface or equipment front end module robot; one or more inter-substrate nozzle arrays supported by the frame and configured to spray gas into a substrate carrier; and one or more curtain nozzle arrays supported by the frame and configured to spray gas across an opening of the substrate carrier. Numerous additional aspects are disclosed.