Abstract: An accelerator circuit is provided that includes an inverter chain having an input coupled to a data line and a sense circuit having inputs coupled to an output of the inverter chain and the data line. The sense circuit is configured to sense a rise toward a supply voltage on the data line or a fall toward a ground voltage on the data line. The accelerator circuit further includes an amplify circuit having inputs coupled to outputs of the sense circuit and an output coupled to the data line, where the amplify circuit is configured to amplify the data line toward the supply voltage or toward the ground voltage based on amplify enable signals output by the sense circuit.

Abstract: An accelerator circuit is provided that includes an inverter chain having an input coupled to a data line and a sense circuit having inputs coupled to an output of the inverter chain and the data line. The sense circuit is configured to sense a rise toward a supply voltage on the data line or a fall toward a ground voltage on the data line. The accelerator circuit further includes an amplify circuit having inputs coupled to outputs of the sense circuit and an output coupled to the data line, where the amplify circuit is configured to amplify the data line toward the supply voltage or toward the ground voltage based on amplify enable signals output by the sense circuit.

Abstract: Level shifters are disclosed for high performance sub-micron IC designs. One embodiment is a level shifting device that comprises a first input circuit that toggles a first internal signal between a logical zero of a first voltage range and a logical one of a second voltage range based on an input data signal and an output data signal, and a second input circuit that toggles a second internal signal between a logical zero of the second voltage range and a logical one of the first voltage range based on the input data signal and the output data signal. An output circuit of the device toggles the output data signal between a logical zero of the second voltage range and a logical one of the second voltage range based on the first internal signal, the second internal signal, and a compliment of the input data signal.

Abstract: In certain embodiments, a method and apparatus for adjusting the timing of a sense-amplifier read operation in an SRAM integrated memory circuit to overcome process-and-temperature variations are disclosed. A charge-injection pull-up transistor is provided to adjust the rate at which a signal line (e.g., a tracking bit line (TBL) and/or a clock signal (e.g., GCLKB)) transitions from one voltage level to another voltage level. A process-and-temperature-dependent bias circuit is provided to control the charge-injection pull-up transistor. The bias circuit causes the charge-injection pull-up transistor to adjust the discharge rate or transition rate of the signal line to compensate for timing delays caused by process or temperature variations.

Abstract: A memory includes a number of storage elements connected to a pair of bit-lines, a bit-line pre-charging circuit, a sense amplifier connected to the pair of bit-lines through a column-select switch, a transition detection circuit connected to an output of the sense amplifier, and a local pre-charge control circuit connected to the transition detection circuit and having a local pre-charge control signal output connected to the bit-line pre-charging circuit.

Abstract: A memory cell array includes local input/output logic configured to access memory cells in memory banks. The memory cell array includes inner memory banks disposed in either direction from the local input/output logic. The memory cell array includes outer memory banks disposed beyond the inner memory banks in either direction from the local input/output logic. The memory cell array further includes local bitlines that run in a lower metallization layer of each of the memory banks. The local bitlines of the outer memory banks connect to the local input/output logic via an upper metallization layer across regions of the inner memory banks.

Abstract: In one embodiment, a self-timed, dual-rail SRAM includes a self-timing circuit having a logic gate that is powered by voltage VDD and configured to receive a fire-sense-amplifier timing signal and to produce a VDD-domain sense-amplifier-enable signal SOELV. The self-timing circuit includes an inverting level-shifter having complementary N-type and P-type transistors connected in series between voltage VDDA and ground. The N-type transistor's gate is connected to signal SOELV, and both transistors' drain terminals are connected together to produce output signal SOEHVB. The inverting level-shifter also includes two series-connected P-type transistors connected (i) between supply voltage VDDA and the output and (ii) in parallel with the first P-type (pull-up) transistor. An inverter is connected between the output node and the control terminal of one of the series transistors, and the other series-transistor's gate is connected to signal SOELV.

Abstract: A memory cell array includes local input/output logic configured to access memory cells in memory banks. The memory cell array includes inner memory banks disposed in either direction from the local input/output logic. The memory cell array includes outer memory banks disposed beyond the inner memory banks in either direction from the local input/output logic. The memory cell array further includes local bitlines that run in a lower metallization layer of each of the memory banks. The local bitlines of the outer memory banks connect to the local input/output logic via an upper metallization layer across regions of the inner memory banks.

Abstract: Word line decoders for dual rail SRAM devices are disclosed for high performance sub-micron SRAM designs. One embodiment is an SRAM device that includes a memory cell array and a word line traversing the memory cell array for selecting memory cells of the memory cell array. A row decode-driver coupled to the word line toggles the word line between logic levels of a memory cell supply based on select signals that toggle between logic levels of a peripheral supply. The row decoder-driver toggles the word line without utilizing level shifters along the word line access path.

Abstract: A memory includes a number of storage elements connected to a pair of bit-lines, a bit-line pre-charging circuit, a sense amplifier connected to the pair of bit-lines through a column-select switch, a transition detection circuit connected to an output of the sense amplifier, and a local pre-charge control circuit connected to the transition detection circuit and having a local pre-charge control signal output connected to the bit-line pre-charging circuit.

Abstract: Level shifters are disclosed for high performance sub-micron IC designs. One embodiment is a level shifting device that comprises a first input circuit that toggles a first internal signal between a logical zero of a first voltage range and a logical one of a second voltage range based on an input data signal and an output data signal, and a second input circuit that toggles a second internal signal between a logical zero of the second voltage range and a logical one of the first voltage range based on the input data signal and the output data signal. An output circuit of the device toggles the output data signal between a logical zero of the second voltage range and a logical one of the second voltage range based on the first internal signal, the second internal signal, and a compliment of the input data signal.

Abstract: Word line assist circuits are disclosed for high performance sub-micron SRAM designs. One embodiment is an SRAM device that includes a memory cell array and a pair of word lines that traverse the memory cell array for selecting memory cells. The SRAM device further includes a pair of word line drivers, each coupled to one of the word lines. The SRAM device further includes a word line assist circuit coupled to the pair of word lines that receives an enable signal. Responsive to receiving the enable signal, the word line assist circuit assists the first word line driver and the second word line driver in transitioning their respective word lines from a logic level zero to a logic level one in response to a voltage differential between the word lines.

Abstract: Systems and methods presented herein provide for integrated read/write tracking in an SRAM device. In one embodiment, an SRAM device includes a clock, a memory cell array, a column of dummy bit cells operable to mirror bit line loading of the memory cell array, and a row of dummy bit cells operable to mirror word line loading of the memory cell array. The SRAM devices also includes a read/write tracking cell operable to track read operations from the memory cell array via the dummy bit cells, to track write operations to the memory cell array via the dummy bit cells, and to reset the clock based on the tracked read operations and the tracked write operations.

Abstract: In one embodiment, a self-timed, dual-rail SRAM includes a self-timing circuit having a logic gate that is powered by voltage VDD and configured to receive a fire-sense-amplifier timing signal and to produce a VDD-domain sense-amplifier-enable signal SOELV. The self-timing circuit includes an inverting level-shifter having complementary N-type and P-type transistors connected in series between voltage VDDA and ground. The N-type transistor's gate is connected to signal SOELV, and both transistors' drain terminals are connected together to produce output signal SOEHVB. The inverting level-shifter also includes two series-connected P-type transistors connected (i) between supply voltage VDDA and the output and (ii) in parallel with the first P-type (pull-up) transistor. An inverter is connected between the output node and the control terminal of one of the series transistors, and the other series-transistor's gate is connected to signal SOELV.

Abstract: In certain embodiments, a method and apparatus for adjusting the timing of a sense-amplifier read operation in an SRAM integrated memory circuit to overcome process-and-temperature variations are disclosed. A charge-injection pull-up transistor is provided to adjust the rate at which a signal line (e.g., a tracking bit line (TBL) and/or a clock signal (e.g., GCLKB)) transitions from one voltage level to another voltage level. A process-and-temperature-dependent bias circuit is provided to control the charge-injection pull-up transistor. The bias circuit causes the charge-injection pull-up transistor to adjust the discharge rate or transition rate of the signal line to compensate for timing delays caused by process or temperature variations.

Abstract: One embodiment is an apparatus that has a memory array, a discharge device, and a discharge assistance controller. The memory array has memory cells arranged in at least one column that is coupled to a read bit line, and the discharge device is configured to provide discharge assistance to the read bit line. The discharge assistance controller is configured to modify duration of the discharge assistance in correlation with capacitance of the read bit line.

Abstract: A write-tracking circuit for a writable memory array has one or more dummy memory cells and is configured to write different values to the one or more dummy memory cells. Durations of pulses applied to word lines of the memory array during write operations are controlled based on durations of writing the different values to the one or more dummy memory cells. In at least some embodiments, the write-tracking circuit is configured to write the different values to the one or more dummy memory cells during a single write operation. In at least some embodiments, the write-tracking circuit is configured to write the different values to at least one of the one or more dummy memory cells during different write operations.

Abstract: A write-tracking circuit for a writable memory array has one or more dummy memory cells and is configured to write different values to the one or more dummy memory cells. Durations of pulses applied to word lines of the memory array during write operations are controlled based on durations of writing the different values to the one or more dummy memory cells. In at least some embodiments, the write-tracking circuit is configured to write the different values to the one or more dummy memory cells during a single write operation. In at least some embodiments, the write-tracking circuit is configured to write the different values to at least one of the one or more dummy memory cells during different write operations.

Abstract: A memory device having an array of memory cells and BTI-independent bias circuitry for controlling the bias voltage level of a source node of the array. The bias circuitry has an n-type transistor and a p-type transistor connected in parallel between ground and the source node. The bias circuitry also has circuitry for controlling the n-type and p-type transistors such that the memory device can be selectively configured in any of an active mode (where the source node is driven towards ground such that the array can be accessed), a low-leakage-current light sleep mode (where the source node is driven towards an intermediate, data-retention voltage level such that the array cannot be accessed but will retain data), and an even-lower-leakage-current shutdown mode (where the source node is driven towards the power supply voltage level such that the array cannot be accessed and cannot retain data).

Abstract: A memory device comprises a memory block, a power gating transistor, and control circuitry. The memory block includes at least one memory cell comprising a storage element electrically connected to a source potential line, a drive strength of the storage element being a function of a voltage level on the source potential line. The power gating transistor, in turn, is connected between the source potential line and a voltage source. The control circuitry is operative to configure the power gating transistor to electrically connect the source potential line to the voltage source while the memory block is in a first mode, and to clamp the source potential line at a voltage different from that of the voltage source when the memory block is in a second mode.