Patents by Inventor Dharmendra Saraswat

Dharmendra Saraswat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10971450
    Abstract: Hexagonally arranged connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be patterns for solder ball arrays or other types of connection mechanisms under a semiconductor package. Despite the increased density of the connection patterns, the connection patterns meet the demanding crosstalk specifications for high speed operation of the high density circuitry.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: April 6, 2021
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Arun Ramakrishnan, Reza Sharifi, Dharmendra Saraswat
  • Publication number: 20200235052
    Abstract: Hexagonally arranged connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be patterns for solder ball arrays or other types of connection mechanisms under a semiconductor package. Despite the increased density of the connection patterns, the connection patterns meet the demanding crosstalk specifications for high speed operation of the high density circuitry.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 23, 2020
    Applicant: Avago Technologies International Sales Pte. Limited
    Inventors: Arun RAMAKRISHNAN, Reza SHARIFI, Dharmendra SARASWAT
  • Patent number: 8992252
    Abstract: A receptacle assembly includes a contact module having a conductive holder and a frame assembly received in the conductive holder and electrically shielded by the conductive holder. The frame assembly has a plurality of receptacle signal contacts having mating portions extending from the conductive holder. The receptacle signal contacts are arranged in differential pairs carrying differential signals. Ground shields are received in the conductive holder between the frame assembly and the conductive holder. The ground shields have grounding beams extending along the mating portions of the receptacle signal contacts. The grounding beams are arranged on four sides of each differential pair of the receptacle signal contacts.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: March 31, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Justin Shane McClellan, Jeffrey Byron McClinton, James Lee Fedder, Justin Pickel, Timothy Robert Minnick, Dharmendra Saraswat, Alex Michael Sharf
  • Publication number: 20150064968
    Abstract: A receptacle assembly includes a contact module having a conductive holder and a frame assembly held by the conductive holder. The conductive holder has a first holder member and second holder member coupled to the first holder member. The conductive holder has a chamber between the first and second holder members divided into a plurality of channels by first tabs of the first holder member and second tabs of the second holder member. The first tabs have posts extending therefrom and the second tabs have holes receiving the posts of the first tabs. Each post has a plurality of termination points with the corresponding tab. The first and second holder members are electrically connected to one another at the termination points. The first and second tabs pass between contacts of the frame assembly to provide electrical shielding therebetween.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 5, 2015
    Applicant: Tyco Electronics Corporation
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, JR., Kyle Gary Annis, Alex Michael Sharf, Dave Helster, Dharmendra Saraswat, Timothy Robert Minnick
  • Publication number: 20130288525
    Abstract: A receptacle assembly includes a contact module having a conductive holder and a frame assembly received in the conductive holder and electrically shielded by the conductive holder. The frame assembly has a plurality of receptacle signal contacts having mating portions extending from the conductive holder. The receptacle signal contacts are arranged in differential pairs carrying differential signals. Ground shields are received in the conductive holder between the frame assembly and the conductive holder. The ground shields have grounding beams extending along the mating portions of the receptacle signal contacts. The grounding beams are arranged on four sides of each differential pair of the receptacle signal contacts.
    Type: Application
    Filed: December 18, 2012
    Publication date: October 31, 2013
    Applicant: Tyco Electronics Corporation
    Inventors: Justin Shane McClellan, Jeffrey Byron McClinton, James Lee Fedder, Justin Pickel, Timothy Robert Minnick, Dharmendra Saraswat, Alex Michael Sharf
  • Patent number: 8500487
    Abstract: A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder having a first side wall and an opposite second side wall. The conductive holder has a chamber between the first and second side walls. The conductive holder has a front coupled to the front housing. The contact module includes a frame assembly that is received in the chamber. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The contacts extend from the conductive holder for electrical termination. A plurality of ground clips are received in the chamber and extend from the front of the conductive holder. The ground clips are mechanically and electrically connected to the conductive holder.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: August 6, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Chad William Morgan, Timothy Robert Minnick, Dharmendra Saraswat, Nathan William Swanger, Charles S. Pickles, Justin Shane McClellan, Lynn Robert Sipe, James Lee Fedder
  • Publication number: 20130122744
    Abstract: A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder having a first side wall and an opposite second side wall. The conductive holder has a chamber between the first and second side walls. The conductive holder has a front coupled to the front housing. The contact module includes a frame assembly that is received in the chamber. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The contacts extend from the conductive holder for electrical termination. A plurality of ground clips are received in the chamber and extend from the front of the conductive holder. The ground clips are mechanically and electrically connected to the conductive holder.
    Type: Application
    Filed: November 15, 2011
    Publication date: May 16, 2013
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Chad William MORGAN, Timothy Robert MINNICK, Dharmendra SARASWAT, Nathan William SWANGER, Charles S. PICKLES, Justin Shane MCCLELLAN, Lynn Robert SIPE, James Lee FEDDER
  • Patent number: 8398432
    Abstract: A receptacle assembly includes a contact module having a conductive holder has a first side and an opposite second side. The conductive holder has a chamber between the first and second sides. A frame assembly is received in the chamber of the conductive holder. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts. The contacts extend from the conductive holder for electrical termination. A ground lead frame is received in the chamber between the frame assembly and the conductive holder. The ground leadframe has grounding members that extend from the conductive holder for electrical termination to header shields of the header assembly.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 19, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Justin Shane McClellan, Jeffrey Byron McClinton, James Lee Fedder, Nathan William Swanger, Charles S. Pickles, Timothy Robert Minnick, Chad W. Morgan, Dharmendra Saraswat
  • Patent number: 8308512
    Abstract: A connector assembly includes contact modules having dielectric bodies holding contacts having mating portions extending from the dielectric body. The connector assembly includes a conductive shield body holding the contact modules in a stacked configuration. The shield body provides shielding around the contact modules and the shield body has a mating end configured to be mated to a mating connector assembly. The mating end has one or more exposed surfaces between corresponding contacts. The shield body extends between selected contact modules. The connector assembly includes a conductive gasket positioned along the mating end of the shield body. The conductive gasket engages the exposed surfaces of the shield body to define a ground path between the conductive shield body and the mating connector assembly.
    Type: Grant
    Filed: January 17, 2011
    Date of Patent: November 13, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: Christopher David Ritter, Wayne Samuel Davis, Robert Neil Whiteman, Jr., Dharmendra Saraswat
  • Publication number: 20120184138
    Abstract: A connector assembly includes contact modules having dielectric bodies holding contacts having mating portions extending from the dielectric body. The connector assembly includes a conductive shield body holding the contact modules in a stacked configuration. The shield body provides shielding around the contact modules and the shield body has a mating end configured to be mated to a mating connector assembly. The mating end has one or more exposed surfaces between corresponding contacts. The shield body extends between selected contact modules. The connector assembly includes a conductive gasket positioned along the mating end of the shield body. The conductive gasket engages the exposed surfaces of the shield body to define a ground path between the conductive shield body and the mating connector assembly.
    Type: Application
    Filed: January 17, 2011
    Publication date: July 19, 2012
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: WAYNE SAMUEL DAVIS, ROBERT NEIL WHITEMAN, JR., CHRISTOPHER DAVID RITTER, DHARMENDRA SARASWAT
  • Patent number: 8157595
    Abstract: A ground shield is provided for an electrical connector mounted on a printed circuit. The ground shield includes a body extending from a mating interface to a mounting interface. An electrical ground path is defined through the body between the mating and mounting interfaces. The mating interface includes a mating contact configured to engage a mating connector. The mounting interface includes a mounting contact configured to engage the printed circuit. The body includes two conductive layers separated by a dielectric substance such that a capacitor is provided within the electrical ground path.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: April 17, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: Dharmendra Saraswat, David Helster
  • Publication number: 20120015556
    Abstract: A ground shield is provided for an electrical connector mounted on a printed circuit. The ground shield includes a body extending from a mating interface to a mounting interface. An electrical ground path is defined through the body between the mating and mounting interfaces. The mating interface includes a mating contact configured to engage a mating connector. The mounting interface includes a mounting contact configured to engage the printed circuit. The body includes two conductive layers separated by a dielectric substance such that a capacitor is provided within the electrical ground path.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Applicant: Tyco Electronics Corporation
    Inventors: Dharmendra Saraswat, David Helster
  • Patent number: 7988491
    Abstract: A contact module is provided for an electrical connector. The contact module includes a housing having a mating edge, a mounting edge, and a side. An electrical lead is held by the housing. The electrical lead extends from a mating contact to a mounting contact. The mating contact extends outwardly from the mating edge of the housing. The mounting contact extends outwardly from the mounting edge of the housing. An inner ground shield is mounted on the housing. The inner ground shield includes a housing side segment that extends over at least a portion of the side of the housing between the mating and mounting edges thereof. An outer ground shield is mounted on the housing. The outer ground shield extends over at least a portion of the housing side segment of the inner ground shield.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: August 2, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, Jr., Dharmendra Saraswat
  • Patent number: 7976340
    Abstract: A connector system includes a header connector, a mating connector, and a conductive grounding bridge. The header connector includes a conductive shell that defines an interior chamber and a contact disposed in the interior chamber. The mating connector includes a conductive member and an electromagnetic shield joined to a housing. The shield has an elongated protrusion extending from the shield to an outer end. The header connector and the mating connector couple with each other such that the contact engages the conductive member and the protrusion engages the shell. The grounding bridge is joined to one of the header connector and the mating connector and engages another of the header connector and the mating connector when the protrusion engages the shell. The protrusion is electrically coupled with the shell at the outer end of the protrusion and by the grounding bridge.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: July 12, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Dharmendra Saraswat, Timothy Robert Minnick, Lynn Robert Sipe
  • Publication number: 20110143591
    Abstract: A contact module is provided for an electrical connector. The contact module includes a housing having a mating edge, a mounting edge, and a side. An electrical lead is held by the housing. The electrical lead extends from a mating contact to a mounting contact. The mating contact extends outwardly from the mating edge of the housing. The mounting contact extends outwardly from the mounting edge of the housing. An inner ground shield is mounted on the housing. The inner ground shield includes a housing side segment that extends over at least a portion of the side of the housing between the mating and mounting edges thereof. An outer ground shield is mounted on the housing. The outer ground shield extends over at least a portion of the housing side segment of the inner ground shield.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 16, 2011
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, JR., Dharmendra Saraswat