Abstract: An electronic device may be provided with electronic components such as mapping circuitry for measuring distances, areas, volumes or other properties of objects in the surrounding environment of the device. The mapping circuitry may include a laser sensor and device position detection circuitry. The device may include processing circuitry configured to gather laser sample data and device position data using the laser sensor and the device position detection circuitry. The laser sample data and the device position data may be gathered while pointing a laser beam generated with a laser in the laser sensor at one or more sample points on a surface such as a surface of a wall. By tracking the device position and orientation using the device position detection circuitry, the objects may be mapped while gathering laser sample data from any position with respect to the object.

Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.

Abstract: Systems and methods for forming button assemblies for electronic devices are disclosed. According to some embodiments, the button assemblies include one or more sound improvement features to improve the sound that the button assemblies make when pressed by users of the electronic devices. According to some embodiments, the button assemblies include shims that provide proper alignment of the various components of the button assemblies and to accommodate any tolerance stack up of the various components of the button assemblies. The shims can include alignment features to prevent the shims from shifting within the button assemblies. According to some embodiments, thicknesses of the shims are customized to accommodate varying tolerance stack ups of the components of the button assemblies. In some embodiments, the button assemblies include a combination of sound improvement features and shims.

Abstract: An aesthetically pleasing docking station that is able to support electronic devices with only an interface connector. The docking station is further equipped with mechanisms that protect the electronic device from damage if it's deflected too far while mated to the docking station.

Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.

Abstract: Embodiments are directed to a wearable device including first and second band straps attached to a device body. A buckle mechanism is configured to attach the first band strap to the second band strap and includes a spring bar attached to an end of the first band strap and a buckle loop engaged to the spring bar. A tang is configured to engage a hole formed in the second band strap to secure the first band strap to the second band strap. The tang defines an aperture that receives the spring bar and is configured to pivot about an offset axis that is offset with respect to an axis of the bar. As the tang is rotated, a restoring force biases the tang toward the buckle loop.

Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.

Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.

Abstract: Cylindrical switch assemblies and methods of making the same are provided. Cylindrical switch assemblies can mitigate false presses by using switch assembly designs with vertically or near vertically mounted activation elements positioned around a perimeter of a button. The activation elements (e.g., switches) of the switch assemblies may be fixed to a vertical sidewall of a bracket and positioned such that a portion of the activation elements extend beneath the button. When the button is actuated by a user, the button activates the activation elements. Positioning multiple activation elements around the perimeter of the button ensures that the user can press anywhere on the button and still activate the activation elements.

Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.

Abstract: A connector providing both an electrical and mechanical connection and an electronic device utilizing the connector. The connector includes a rigid body, a head connected to the rigid body, and a flexible conductor coupled to the body. The rigid body and the flexible conductor define an electrically conductive path to the head. An electronic device includes a housing defining at least one sidewall, an interior component, and a connector passing through at least one sidewall and mechanically contacting the interior component. The connector defines an electrically conductive path from the interior component to an exterior of the housing.

Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

Abstract: An electronic device may be provided with electronic components such as mapping circuitry for measuring distances, areas, volumes or other properties of objects in the surrounding environment of the device. The mapping circuitry may include a laser sensor and device position detection circuitry. The device may include processing circuitry configured to gather laser sample data and device position data using the laser sensor and the device position detection circuitry. The laser sample data and the device position data may be gathered while pointing a laser beam generated with a laser in the laser sensor at one or more sample points on a surface such as a surface of a wall. By tracking the device position and orientation using the device position detection circuitry, the objects may be mapped while gathering laser sample data from any position with respect to the object.

Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.

Abstract: Reinforcing bars or a reinforcing element with holes can be embedded within the shell of a receptacle connector to strengthen the shell, and potentially provide shielding. For example, a receptacle connector having a plurality of contacts configured to mate with corresponding contacts of a corresponding plug connector can include a shell having an opening for receiving the corresponding plug connector. The shell can include an upper portion and reinforcing bars embedded within the upper portion. The shell can include an upper portion and a reinforcing element with holes embedded within the upper portion. Methods for manufacturing the shell are also provided.

Abstract: A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.

Abstract: Cylindrical switch assemblies and methods of making the same are provided. Cylindrical switch assemblies can mitigate false presses by using switch assembly designs with vertically or near vertically mounted activation elements positioned around a perimeter of a button. The activation elements (e.g., switches) of the switch assemblies may be fixed to a vertical sidewall of a bracket and positioned such that a portion of the activation elements extend beneath the button. When the button is actuated by a user, the button activates the activation elements. Positioning multiple activation elements around the perimeter of the button ensures that the user can press anywhere on the button and still activate the activation elements.

Abstract: Reinforcing bars or a reinforcing element with holes can be embedded within the shell of a receptacle connector to strengthen the shell, and potentially provide shielding. For example, a receptacle connector having a plurality of contacts configured to mate with corresponding contacts of a corresponding plug connector can include a shell having an opening for receiving the corresponding plug connector. The shell can include an upper portion and reinforcing bars embedded within the upper portion. The shell can include an upper portion and a reinforcing element with holes embedded within the upper portion. Methods for manufacturing the shell are also provided.

Abstract: A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.

Abstract: A method and apparatus for inter-domain routing of calls in a network, where the network represents a first wide area network. A routing node of the network advertises its access to a range of addresses in a second wide area network and a cost for access to the range of addresses to all adjacent nodes in the network. Each of the adjacent nodes inserts an entry in its own routing table associating access to the range of addresses in the second wide area network with the network address of the routing node and the cost for access. Each adjacent node then modifies the cost for access by adding its own cost and advertises its access to the range of addresses in the second wide area network and the modified cost for access to all of its adjacent nodes.