Patents by Inventor Dheeraj SUBAREDDY

Dheeraj SUBAREDDY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220114121
    Abstract: A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 14, 2022
    Inventors: Anshuman THAKUR, Dheeraj SUBAREDDY, MD Altaf HOSSAIN, Ankireddy NALAMALPU, Mahesh KUMASHIKAR, Sandeep SANE