Patents by Inventor DHEERAJ SUBBAREDDY
DHEERAJ SUBBAREDDY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929339Abstract: An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.Type: GrantFiled: April 13, 2023Date of Patent: March 12, 2024Assignee: Intel CorporationInventors: Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy
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Patent number: 11915996Abstract: An integrated circuit structure that includes a first integrated circuit package and a second integrated circuit package is described. The two packages can be stacked above, for example, a printed circuit board. The top package is inverted, such that a first die of that top package is facing a second die of the bottom package. A cooling arrangement is in a gap between the first and second integrated circuit packages, and is thermally coupled to the first and second die. The cooling arrangement is to transfer heat generated by a first die of the first integrated circuit package and a second die of the second integrated circuit package. In some cases, structures comprising electrically conductive material (e.g., metal) are encapsulated by a molding compound or insulator, and extend between a first substrate of the first integrated circuit package and a second substrate of the second integrated circuit package.Type: GrantFiled: May 9, 2019Date of Patent: February 27, 2024Assignee: Intel CorporationInventors: Robert Sankman, Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy
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Patent number: 11901299Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.Type: GrantFiled: December 12, 2022Date of Patent: February 13, 2024Assignee: Intel CorporationInventors: Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik, Ram S. Viswanath, Sandeep B. Sane, Sriram Srinivasan, Rajat Agarwal, Aravind Dasu, Scott Weber, Ravi Gutala
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Publication number: 20240028544Abstract: An integrated circuit device may include a first network on chip (NOC) circuit configured to receive a set of data and transfer the set of data to a first node of the first NOC circuitry. The first node is configured to transfer the set of data to a second NOC circuit of an additional integrated circuit device separate from the integrated circuit device.Type: ApplicationFiled: September 29, 2023Publication date: January 25, 2024Inventors: Sharath Raghava, Dheeraj Subbareddy, Kavitha Prasad, Ankireddy Nalamalpu, Harsha Gupta
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Publication number: 20230370068Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.Type: ApplicationFiled: May 16, 2023Publication date: November 16, 2023Inventors: Sharath Raghava, Ankireddy Nalamalpu, Dheeraj Subbareddy, Harsha Gupta, James Ball, Kavitha Prasad, Sean R. Atsatt
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Publication number: 20230352431Abstract: An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.Type: ApplicationFiled: April 13, 2023Publication date: November 2, 2023Inventors: MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy
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Patent number: 11789883Abstract: An integrated circuit device may include a first network on chip (NOC) circuit configured to receive a set of data and transfer the set of data to a first node of the first NOC circuitry. The first node is configured to transfer the set of data to a second NOC circuit of an additional integrated circuit device separate from the integrated circuit device.Type: GrantFiled: August 14, 2018Date of Patent: October 17, 2023Assignee: INTEL CORPORATIONInventors: Sharath Raghava, Dheeraj Subbareddy, Kavitha Prasad, Ankireddy Nalamalpu, Harsha Gupta
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Publication number: 20230306173Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.Type: ApplicationFiled: May 31, 2023Publication date: September 28, 2023Inventors: Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang
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Patent number: 11714941Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.Type: GrantFiled: August 2, 2021Date of Patent: August 1, 2023Assignee: Intel CorporationInventors: Chee Hak Teh, Ankireddy Nalamalpu, Md Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang
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Patent number: 11700002Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.Type: GrantFiled: December 20, 2021Date of Patent: July 11, 2023Assignee: Intel CorporationInventors: Sharath Raghava, Ankireddy Nalamalpu, Dheeraj Subbareddy, Harsha Gupta, James Ball, Kavitha Prasad, Sean R. Atsatt
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Publication number: 20230198526Abstract: A programmable device may have logic circuitry formed in a top die and memory and specialized processing blocks formed in a bottom die, where the top die is stacked directly on top of the bottom die in a face-to-face configuration. The logic circuitry may include logic sectors, logic array blocks, logic elements, and other types of logic regions. The memory blocks may include large banks of multiport memory for storing data. The specialized processing blocks may include multipliers, adders, and other arithmetic components. The logic circuitry may access the memory and specialized processing blocks via an address encoded scheme. Configured in this way, the maximum operating frequency of the programmable device can be optimized such that critical paths will no longer need to traverse any unused memory and specialized processing blocks.Type: ApplicationFiled: February 16, 2023Publication date: June 22, 2023Inventors: Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath Mahajan, Gregg William Baeckler
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Patent number: 11669472Abstract: Systems and method include one or more die coupled to an interposer. The interposer includes interconnection circuitry configured to electrically connect the one or more die together via the interposer. The interposer also includes translation circuitry configured to translate communications as they pass through the interposer. For instance, in the interposer, the translation circuitry translates communications, in the interposer, from a first protocol of a first die of the one or more die to a second protocol of a second die of the one or more die.Type: GrantFiled: December 6, 2021Date of Patent: June 6, 2023Assignee: Intel CorporationInventors: Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh, Md Altaf Hossain
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Patent number: 11658144Abstract: An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.Type: GrantFiled: September 3, 2021Date of Patent: May 23, 2023Assignee: Intel CorporationInventors: Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy
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Publication number: 20230129176Abstract: A method includes mapping an aging measurement circuit (AMC) into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.Type: ApplicationFiled: December 21, 2022Publication date: April 27, 2023Applicant: Intel CorporationInventors: Dheeraj Subbareddy, Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan
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Publication number: 20230107106Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.Type: ApplicationFiled: December 12, 2022Publication date: April 6, 2023Inventors: MD Altaf HOSSAIN, Ankireddy NALAMALPU, Dheeraj SUBBAREDDY, Robert SANKMAN, Ravindranath V. MAHAJAN, Debendra MALLIK, Ram S. VISWANATH, Sandeep B. SANE, Sriram SRINIVASAN, Rajat AGARWAL, Aravind DASU, Scott WEBER, Ravi GUTALA
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Patent number: 11621713Abstract: Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.Type: GrantFiled: August 20, 2021Date of Patent: April 4, 2023Assignee: Intel CorporationInventors: Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy
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Patent number: 11609262Abstract: An integrated circuit die includes a core fabric configurable to include an aging measurement circuit and a device manager coupled to the core fabric to operate the aging measurement circuit for a select period of time. The aging measurement circuit includes a counter to count transitions of a signal propagating through the aging measurement circuit during the select period of time when the aging measurement circuit is operating. The transitions of the signal counted by the counter during the select period of time are a measure of an aging characteristic of the integrated circuit die.Type: GrantFiled: December 25, 2018Date of Patent: March 21, 2023Assignee: Intel CorporationInventors: Dheeraj Subbareddy, Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan
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Patent number: 11610856Abstract: An integrated circuit package may be formed comprising an interposer with a center die and a plurality of identical integrated circuit dice positioned around the center die and attached to the interposer, wherein the center die is the switch/router for the plurality of identical integrated circuit dice. The interposer comprises a substrate, a central pattern of bond pads formed in or on the substrate for attaching the center die, and substantially identical satellite patterns formed in or on the substrate for attaching identical integrated circuit dice. The central pattern of bond pads has repeating sets of a specific geometric pattern and wherein the identical satellite patterns of bond pads are positioned to form the same geometric pattern as the specific geometric pattern of the central pattern of bond pads. Thus, substantially identical conductive routes may be formed between the center die and each of the identical integrated circuit dice.Type: GrantFiled: June 24, 2019Date of Patent: March 21, 2023Assignee: Intel CorporationInventors: Robert Sankman, Dheeraj Subbareddy, Md Altaf Hossain, Ankireddy Nalamalpu
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Patent number: 11595045Abstract: A programmable device may have logic circuitry formed in a top die and memory and specialized processing blocks formed in a bottom die, where the top die is stacked directly on top of the bottom die in a face-to-face configuration. The logic circuitry may include logic sectors, logic array blocks, logic elements, and other types of logic regions. The memory blocks may include large banks of multiport memory for storing data. The specialized processing blocks may include multipliers, adders, and other arithmetic components. The logic circuitry may access the memory and specialized processing blocks via an address encoded scheme. Configured in this way, the maximum operating frequency of the programmable device can be optimized such that critical paths will no longer need to traverse any unused memory and specialized processing blocks.Type: GrantFiled: June 25, 2021Date of Patent: February 28, 2023Assignee: Intel CorporationInventors: Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath Mahajan, Gregg William Baeckler
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Publication number: 20230049681Abstract: An integrated circuit die includes input buffer circuits that are enabled during an input mode of operation in response to first control signals to transmit input signals into the integrated circuit die from conductive bumps. Each of the input buffer circuits is coupled to one of the conductive bumps. The integrated circuit die also includes output buffer circuits that are each coupled to one of the conductive bumps. The output buffer circuits are enabled during an output mode of operation in response to second control signals to transmit output signals from the integrated circuit die to the conductive bumps. The input buffer circuits are disabled from transmitting signals during the output mode of operation in response to the first control signals. The output buffer circuits are disabled from transmitting signals during the input mode of operation in response to the second control signals.Type: ApplicationFiled: October 25, 2022Publication date: February 16, 2023Applicant: Intel CorporationInventors: Jeffrey Chromczak, Chooi Pei Lim, Lai Guan Tang, Chee Hak Teh, MD Altaf Hossain, Dheeraj Subbareddy, Ankireddy Nalamalpu