Patents by Inventor Dhirendra TRIPATHI

Dhirendra TRIPATHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectromechanical systems (MEMS) and methods
    Patent number: 10850974
    Abstract: The present disclosure relates to a method of fabricating a reflector, the reflector being at least partially reflective and at least partially transmissive for at least a wavelength of electromagnetic radiation; the method comprising: forming a first material layer defining a bottom layer; forming a sacrificial layer on the bottom layer; forming a second material layer defining a top layer on the sacrificial layer and a supporting structure connected to the bottom layer; and removing at least part of the sacrificial layer to form a cavity between the bottom layer and the top layer such that the supporting structure supports the top layer relative to the bottom layer and no further supporting structure is provided within the cavity, wherein after the at least part of the sacrificial layer is removed, at least the top layer has residual tensile stress.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: December 1, 2020
    Assignee: THE UNIVERSITY OF WESTERN AUSTRALIA
    Inventors: Dhirendra Tripathi, Dilusha Silva, Lorenzo Faraone, John Marcel Dell, Jarek Antoszewski, Mariusz Martyniuk
  • Microelectromechanical systems (MEMS) and methods
    Publication number: 20180162724
    Abstract: The present disclosure relates to a method of fabricating a reflector, the reflector being at least partially reflective and at least partially transmissive for at least a wavelength of electromagnetic radiation; the method comprising: forming a first material layer defining a bottom layer; forming a sacrificial layer on the bottom layer; forming a second material layer defining a top layer on the sacrificial layer and a supporting structure connected to the bottom layer; and removing at least part of the sacrificial layer to form a cavity between the bottom layer and the top layer such that the supporting structure supports the top layer relative to the bottom layer and no further supporting structure is provided within the cavity, wherein after the at least part of the sacrificial layer is removed, at least the top layer has residual tensile stress.
    Type: Application
    Filed: May 5, 2016
    Publication date: June 14, 2018
    Applicant: The University of Western Australia
    Inventors: Dhirendra TRIPATHI, Dilusha SILVA, Lorenzo FARAONE, John BUMGARNER, John Marcel DELL, Jarek ANTOSZEWSKI, Mariusz MARTYNIUK, Kirsten BROOKSHIRE, Mao HAIFENG, Yinong LIU