Patents by Inventor Dhivanraj Subramanian

Dhivanraj Subramanian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230282454
    Abstract: Processing chambers, substrate supports and thermal shields are described. A thermal shield comprises a disc-shaped body having a thickness, an outer diameter with a first edge and a second edge at opposite ends of a diameter of the disc-shaped body, a front surface and a back surface defining the thickness. The front surface has a first longitudinal region comprising the first edge and a second longitudinal region comprising the second edge. Coating one or more of the first longitudinal region or the second longitudinal region with an emissivity material (i.e., emissivity) reduces side to side temperature variation. In some embodiments, processing chambers having the thermal shield described herein consume less power than comparative processing chambers that do not include a thermal shield.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 7, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Youngki Chang, Muhannad Mustafa, Kartik Shah, Dhritiman Subha Kashyap, Dhivanraj Subramanian