Patents by Inventor Dhruv Bhate

Dhruv Bhate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093479
    Abstract: A unit cell of an interwoven lattice structure having an interwoven point therein. The unit cell includes first, second, third, and fourth struts each having an interwoven node offset from the interwoven point. The first strut has a first interwoven node offset from a first diagonal unit cell plane in a first distance and first direction. The second strut has a second interwoven node offset from the first diagonal unit cell plane in a second distance and second direction opposite the first direction. The third strut has a third interwoven node offset from a second diagonal unit cell plane in a third distance and third direction. The fourth strut has a fourth interwoven node offset from the second diagonal unit cell plane in a fourth distance and fourth direction opposite the third direction. The first and second diagonal unit cell planes both pass through the interwoven point.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventors: Yash Mistry, Siying Liu, Mandar Shinde, Xiangfan Chen, Dhruv Bhate, Nikhilesh Chawla, Swapnil Morankar, Clint Penick
  • Patent number: 9472505
    Abstract: Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: October 18, 2016
    Assignee: Intel Corporation
    Inventors: Frank Evans, Shipeng Qiu, Dhruv Bhate, Sergei Voronov, Tao Wang
  • Publication number: 20150171017
    Abstract: Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 18, 2015
    Inventors: Frank Evans, Shipeng Qiu, Dhruv Bhate, Sergei Voronov, Tao Wang