Patents by Inventor Di An

Di An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030109905
    Abstract: A wireless biopotential sensor includes an adhesive strip having a lower surface for placement against the skin of a patient and an upper surface. A pair of conductive electrodes are applied to the lower surface of the adhesive strip. A sensor substrate is applied to the upper surface. The sensor substrate includes first and second conductive contact pads that are placed in registry with the pair of conductive electrodes, with the contact pads arranged in electrical contact with the conductive electrodes. An electronics module is applied to the sensor substrate and arranged in electrical contact with the contact pads. The electronics module comprises a power supply and electronics for generating a wireless signal containing biopotential signals detected by the pair of conductive electrodes.
    Type: Application
    Filed: December 7, 2001
    Publication date: June 12, 2003
    Inventors: Swee Mok, Di-An Hong, Thomas S. Babin, Sanjar Ghaem
  • Patent number: 5923988
    Abstract: A process for fabricating a polycide SAC structure, for a MOSFET device, has been developed. This process features a polycide SAC structure, comprised of tungsten silicide on in situ doped polysilicon, using tungsten hexafluoride and dichlorosilane as reactants for deposition of tungsten silicide. A first thermal anneal treatment is performed prior to polycide patterning, supplying protection to exposed tungsten silicide sides, during the patterning procedure. A second thermal anneal treatment is performed after polycide patterning, and prior to a silicon oxide deposition, offering protection to the exposed top surface of tungsten silicide, during the silicon oxide deposition.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: July 13, 1999
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Hsien Cheng, Chi-Di An, Wen Jan Lin, Hung-Che Liao, Jer-Yuan Sheu