Patents by Inventor Di-Shi Su

Di-Shi Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming metal damascene structure to prevent dielectric layer peeling
    Publication number: 20050059233
    Abstract: A process for forming a metal damascene structure. First, a cap layer is formed on a first metal layer, and a dielectric layer is formed on the cap layer. Next, the dielectric layer is etched to form a damascene opening. Next, hydrogen-containing plasma, nitrogen-containing plasma, oxygen-containing plasma, or a mixture thereof is used to perform the plasma treatment. Next, a metal is filled in the damascene opening to form a second metal layer. Peeling of the dielectric layer due to remaining impurities is eliminated by the plasma treatment after etching of the damascene opening.
    Type: Application
    Filed: September 12, 2003
    Publication date: March 17, 2005
    Inventors: Ming-Tsong Wang, Di-Shi Su, Chia-Ming Yang, Ching-Ming Tsai