Abstract: A wafer singulating method includes: providing a wafer product having front and back sides the front side being formed with scribe lines; deep scribing with a laser along the scribe lines on the front side to form a plurality of intersecting trenches; and cleaving the back side along the trenches on the front side. The cleaving of the back side proceeds in different directions each of which is directed to a center of the wafer product from a periphery of the wafer product. The cleaving in each of the directions proceeds along the trenches one after the other from one of the trenches nearest to the periphery of the wafer product and ceases near or at the center.

Abstract: A system and method for reducing a vapor temperature in a packed distillation column. Liquid is collected from a packed section of the packed distillation column in a liquid collector disposed below the packed section. A super-heated vapor is distributed from a vapor feed disposed below the packed section such that the super-heated vapor contacts the liquid of the liquid collector and reduces a temperature of the super-heated vapor.

Abstract: A structured packing arrangement for reducing vapor bypass in the gaps between the edges of structured packing elements or bricks and the packed distillation column wall is provided. The structured packing arrangement includes a high pressure drop shroud attached to portions of the perimeter of the structured packing elements and in the gap between the edge of the structured packing elements and the interior surface of the distillation column wall. The high pressure drop shroud urges the ascending vapor flowing at or near the edges of the structured packing elements to stay within the structured packing elements instead of escaping through the side of the structured packing toward the distillation column wall.

Abstract: An aircraft transparency includes a first ply having a first major surface and a second major surface. A second ply is spaced from the first ply and has a third major surface and a fourth major surface. A polymeric interlayer is located between the first and second plies. At least one bore extends through the first and second plies and the interlayer. A high strength bushing is located in the bore, with an outer sidewall of the bushing in direct contact with the material of the first and second plies. In one embodiment, the bore is a tapered bore and the bushing has a tapered outer sidewall. In another embodiment, the bore is a cylindrical bore and the bushing has a cylindrical outer sidewall.

Abstract: An aircraft transparency includes a first ply having a first major surface and a second major surface. A second ply is spaced from the first ply and has a third major surface and a fourth major surface. A polymeric interlayer is located between the first and second plies. At least one bore extends through the first and second plies and the interlayer. A high strength bushing is located in the bore, with an outer sidewall of the bushing in direct contact with the material of the first and second plies. In one embodiment, the bore is a tapered bore and the bushing has a tapered outer sidewall. In another embodiment, the bore is a cylindrical bore and the bushing has a cylindrical outer sidewall.