Abstract: The present disclosure provides a motion image generation method and apparatus, and a computer device and a storage medium. The method includes: obtaining a pre-drawn target face model; selecting, from a basic face library, at least one basic face model that is matched with the target face model, and determining an initial face model based on skeleton parameters and a skin matrix which respectively correspond to the at least one basic face model; and iteratively adjusting the skeleton parameters of the initial face model based on the initial face model and the target face model to obtain reference skeleton parameters when an error between the initial face model and the target face model is smallest, wherein the reference skeleton parameters are used for producing and generating each frame of images when the target face model moves.

Abstract: A soil layer detection drilling device includes a drilling cylinder, and a soil-sampling assembly is provided inside the drilling cylinder. When the soil is drilled, equipment is in a vertical state, a controller is turned on to control a rotary motor to rotate, and the drilling cylinder is driven to drill the soil with the cooperation of drive wheels and a drive belt. Four slide blocks are evenly distributed around an outer circumference of a sliding disk and are matingly connected with slide grooves provided on an inner wall of the drilling cylinder, so when the drilling cylinder rotates, the soil-sampling assembly also rotates. A conical head first in contact with the ground starts to drill the ground, then the drilling cylinder gradually drills into a soil layer, and the drilling cylinder is idled as the drilling cylinder arrives at a certain depth, to clear soil on auger blades.

Abstract: A soil layer detection drilling device includes a drilling cylinder, and a soil-sampling assembly is provided inside the drilling cylinder. When the soil is drilled, equipment is in a vertical state, a controller is turned on to control a rotary motor to rotate, and the drilling cylinder is driven to drill the soil with the cooperation of drive wheels and a drive belt. Four slide blocks are evenly distributed around an outer circumference of a sliding disk and are matingly connected with slide grooves provided on an inner wall of the drilling cylinder, so when the drilling cylinder rotates, the soil-sampling assembly also rotates. A conical head first in contact with the ground starts to drill the ground, then the drilling cylinder gradually drills into a soil layer, and the drilling cylinder is idled as the drilling cylinder arrives at a certain depth, to clear soil on auger blades.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: Embodiments of the present disclosure provide a method for skinning a character model, a device for skinning a character model, a computer readable medium, and an electronic device, and relate to the field of computer technology. The method comprises: obtaining a first character model and a corresponding skeleton structure; determining a vertex attribute of the first character model and a connecting relationship between the vertices; performing a nonlinear transformation process on the vertex attribute to obtain the first feature, and performing a graph convolution process on the connecting relationship and the first feature to obtain a second feature; determining a global feature and a local feature of the character model according to the second feature; and determining a target feature representing a binding relationship between the first character model and the skeleton hierarchy according to the global feature and the local feature.

Abstract: Embodiments of the present disclosure provide a method for skinning a character model, a device for skinning a character model, a computer readable medium, and an electronic device, and relate to the field of computer technology. The method comprises: obtaining a first character model and a corresponding skeleton structure; determining a vertex attribute of the first character model and a connecting relationship between the vertices; performing a nonlinear transformation process on the vertex attribute to obtain the first feature, and performing a graph convolution process on the connecting relationship and the first feature to obtain a second feature; determining a global feature and a local feature of the character model according to the second feature; and determining a target feature representing a binding relationship between the first character model and the skeleton hierarchy according to the global feature and the local feature.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: A 3D printing system comprises: a digital micro-mirror device (DMD) mobile device (1); a light source (3), fixed on said DMD mobile device (1) for emitting ultraviolet light, blue light or visible light; multiple DMDs (2) carried on the DMD mobile device (1) for receiving the ultraviolet light, blue light or visible light emitted by the light source (3) and generating 3D object section light; a lens (4) for receiving the 3D object section light reflected by the DMDs (2) and refracting and amplifying the 3D object section light; a material box (5) for containing and providing printing materials; a workbench (6), wherein the 3D object section light refracted by the lens irradiates the printing materials provided by the material box (5) to solidify the printing materials into a 3D object carried on the workbench (6); and a lifting device (7) for lifting the workbench (6).

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer.

Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.

Abstract: A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer.

Abstract: A system comprises a plurality of processor cores. The processor cores may comprise one or more application processor (AP) cores and a boot strap processor (BSP) core. A basic input/output system (BIOS) comprises an I/O device module to call a stall function in response to an I/O operation, a power management module that couples to the I/O device and a timer module that couples to the power management module. The power management module is to adjust a timer period of the timer module based on a stall delay of the stall function. The power management module may hook the stall function and compare the stall delay with a predetermined threshold and set the timer period to the stall delay in response to determining that the stall delay is longer. The power management module may put the BSP in a sleep mode during the timer period to save power.

Abstract: A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer.

Abstract: A Quad Flat No-Lead (QFN) semiconductor package includes a die pad; I/O connections disposed at the periphery of the die pad; a chip mounted on the die pad; bonding wires; an encapsulant for encapsulating the die pad, the I/O connections, the chip and the bonding wires while exposing the bottom surfaces of the die pad and the I/O connections; a surface layer formed on the bottoms surfaces of the die pad and the I/O connections; a dielectric layer formed on the bottom surfaces of the encapsulant and the surface layer and having openings for exposing the surface layer. The surface layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the die pad and prevent solder extrusion on the interface of the I/O connections and the dielectric layer, thereby increasing product yield.

Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.

Abstract: A Quad Flat No-Lead (QFN) semiconductor package includes a die pad; I/O connections disposed at the periphery of the die pad; a chip mounted on the die pad; bonding wires; an encapsulant for encapsulating the die pad, the I/O connections, the chip and the bonding wires while exposing the bottom surfaces of the die pad and the I/O connections; a surface layer formed on the bottoms surfaces of the die pad and the I/O connections; a dielectric layer formed on the bottom surfaces of the encapsulant and the surface layer and having openings for exposing the surface layer. The surface layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the die pad and prevent solder extrusion on the interface of the I/O connections and the dielectric layer, thereby increasing product yield.

Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.