Patents by Inventor Dian-Hua Lee

Dian-Hua Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230111518
    Abstract: A circuit board mounting support for supporting a first electronic circuit integration includes a bearing member. The first electronic circuit integration includes a circuit board, an electronic component engaged with a first surface of the circuit board, and multiple legs for engaging with the bearing member. The circuit board has a mounting area for mounting the electronic component and a second surface opposite to the first surface. The bearing member includes a groove and an engaging portion connected to a peripheral edge of the groove. A corresponding area is defined on the bearing member and corresponds to the mounting area of the circuit board. When the bearing member is engaged with the circuit board, an opening of the groove and the engaging portion face the second surface. A junction that each of the legs is engaged with the bearing member is located out of the corresponding area.
    Type: Application
    Filed: September 7, 2022
    Publication date: April 13, 2023
    Applicant: ACCTON TECHNOLOGY CORPORATION
    Inventors: DIAN-HUA LEE, RU-JING JHANG
  • Patent number: 9307659
    Abstract: A constraint mechanism includes a constraint component disposed on a second housing, and a flexible component disposed on a first housing. The constraint component includes a guide slot and an engaging portion. The flexible component includes a main body, a bending portion and a contacting portion. A first edge of the main body is fixed by a side of an opening on the first housing. A first side of the bending portion is connected to the main body, and is located at a position adjacent to a second edge of the main body. The contacting portion is disposed on a second side of the bending portion. A rim of the contacting portion is an arc structure. The contacting portion moves along the guide slot, so that the arc structure can be constrained by the engaging portion, to constrain a movement of the first housing relative to the second housing.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: April 5, 2016
    Assignee: Wistron Corporation
    Inventors: Dian-Hua Lee, Yi-Jiun Lin, Chuan-Yi Liang
  • Publication number: 20140062273
    Abstract: A constraint mechanism includes a constraint component disposed on a second housing, and a flexible component disposed on a first housing. The constraint component includes a guide slot and an engaging portion. The flexible component includes a main body, a bending portion and a contacting portion. A first edge of the main body is fixed by a side of an opening on the first housing. A first side of the bending portion is connected to the main body, and is located at a position adjacent to a second edge of the main body. The contacting portion is disposed on a second side of the bending portion. A rim of the contacting portion is an arc structure. The contacting portion moves along the guide slot, so that the arc structure can be constrained by the engaging portion, to constrain a movement of the first housing relative to the second housing.
    Type: Application
    Filed: June 10, 2013
    Publication date: March 6, 2014
    Inventors: Dian-Hua Lee, Yi-Jiun Lin, Chuan-Yi Liang