Patents by Inventor Diana FELKEL

Diana FELKEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190255659
    Abstract: By using a water-based liquid mixture containing amino acids, the cavities of a hollow component can be filled very easily and very quickly, while nevertheless providing the internal structure with adequate protection. In addition, the filling material can be removed again very easily after the laser drilling.
    Type: Application
    Filed: August 22, 2017
    Publication date: August 22, 2019
    Inventors: CHRISTOPHER DEGEL, DIANA FELKEL, ANDREA MASSA
  • Patent number: 10190419
    Abstract: Introducing a through hole into a substrate (4) before coating, and performing the removal thereafter, shortens the machining times for producing a through hole (18) with a diffuser (13) and also subjects the intermediate layers to less stress.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: January 29, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bahadir Basdere, Diana Felkel, Andrea Massa, Rolf Wilkenhöner, Adrian Wollnik
  • Publication number: 20160325382
    Abstract: A method is provided for protecting a component during laser working or working that produces melt phases, particularly during laser drilling, of the component with a cavity, in which a through-hole is introduced through a wall of the cavity of the component, in which the cavity is filled at least in an area of a region to be worked, including introducing a mixture of a water-based liquid mixture containing amino acid into the cavity as a filling.
    Type: Application
    Filed: December 2, 2014
    Publication date: November 10, 2016
    Inventors: Christopher Degel, Diana Felkel, Andrea Massa
  • Publication number: 20150258634
    Abstract: Introducing a through hole into a substrate (4) before coating, and performing the removal thereafter, shortens the machining times for producing a through hole (18) with a diffuser (13) and also subjects the intermediate layers to less stress.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 17, 2015
    Inventors: Bahadir BASDERE, Diana FELKEL, Andrea MASSA, Rolf WILKENHĂ–NER, Adrian WOLLNIK