Abstract: The present invention relates to a composition containing microparticles which comprise cinmethylin and a polymeric material which surrounds or embeds cinmethylin, and at least one herbicide different from cinmethylin. The invention further relates to a method for preparing such compositions and the use of such compositions for controlling undesired vegetation.

Abstract: The present invention relates to a composition containing microparticles which comprise cinmethylin and a polymeric material which surrounds or embeds cinmethylin, and at least one herbicide different from cinmethylin. The invention further relates to a method for preparing such compositions and the use of such compositions for controlling undesired vegetation.

Abstract: The present invention relates to microcapsules comprising a core, wherein the core comprises cinmethylin, and a polyurea shell, wherein the shell comprises a polyaddition product of diphenylmethane diisocyanate or an oligomer thereof and at least one amine having at least two primary amino groups; to a composition comprising such microcapsules; to a method for preparing such microcapsules or such a composition; to a composition obtainable by said preparation method; and to the use of such microcapsules or compositions for controlling undesired vegetation.

Abstract: The present invention relates to a composition comprising microcapsules, wherein the micro-capsules comprise a polyurea shell and a core, wherein the core comprises cinmethylin and the shell comprises a polymerization product of a tetramethylxylylene and an aliphatic diamine diisocyanate, and, optionally, a cycloaliphatic diisocyanate; to a method for preparing the composition comprising the steps of contacting water, cinmethylin, the diisocyanate and the aliphatic diamine; and to a method of controlling undesired plant growth and/or for regulating the growth of plants, wherein the composition is allowed to act on the soil and/or on undesired plants and/or on the crop plants and/or on their environment.

Abstract: The present invention relates to a a composition comprising microcapsules, which comprise a polyurea shell and a core, wherein the core comprises cinmethylin and the shell comprises a polymerization product of a tetramethylxylylene diisocyanate, and a polyamine with at least three amine groups, and where the polymerization product comprises less than 5 wt % of further isocyanate monomers in polymerized form, based on the weight of the tetramethylxylylene diisocyanate; a method for preparing the composition comprising the steps of contacting water, the cinmethylin, the tetramethylxylylene diisocyanate, and the polyamine; and to a method of controlling undesired plant growth, wherein the composition is allowed to act on the soil and/or on undesired plants and/or on the crop plants and/or on their environment.

Abstract: A chemical-mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a composite or mixture thereof, (B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z), wherein (Z) is a carboxylate (—COOR1), sulfonate (—SO3R2), sulfate (—O—SO3R3), phosphonate (—P(?O)(OR4)(OR5)), phosphate (—O—P(?O)(OR6)(OR7)), carboxylic acid (—COOH), sulfonic acid (—SO3H), sulfuric acid (—O—SO3—), phosphonic acid (—P(?O)(OH)2), phosphoric acid (—O—P(?O)(OH)2) moiety, or their deprotonated forms, R1 is alkyl, aryl, alkylaryl, or arylalkyl R2 is alkyl, aryl, alkylaryl, or arylalkyl, R3 is alkyl, aryl, alkylaryl, or arylalkyl, R4 is alkyl, aryl, alkylaryl, or arylalkyl, R5 is H, alkyl, aryl, alkylaryl, or arylalkyl, R6 is alkyl, aryl, alkylaryl, or arylalkyl, R7 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.

Abstract: The present invention relates to a method for preparing a tank mix, which comprises the step of contacting a pesticide formulation, water, and a tank mix adjuvant which comprises a carbonate of the formula (I); to a pesticide formulation comprising the tank mix adjuvant; to a method of controlling phytopathogenic fungi and/or undesired vegetation and/or undesired insect or mite attack and/or for regulating the growth of plants, wherein the tank mix or the pesticide formulation is allowed to act on the respective pests, their environment or the plants to be protected from the respective pest, on the soil and/or on undesired plants and/or the crop plants and/or their environment; and to a use of the tank mix adjuvant for increasing the efficacyl of a pesticide.

Abstract: The present invention relates to a method for preparing a tank mix, which comprises the step of contacting a pesticide formulation, water, and a tank mix adjuvant which comprises a carbonate of the formula (I); to a pesticide formulation comprising the tank mix adjuvant; to a method of controlling phytopathogenic fungi and/or undesired vegetation and/or undesired insect or mite attack and/or for regulating the growth of plants, wherein the tank mix or the pesticide formulation is allowed to act on the respective pests, their environment or the plants to be protected from the respective pest, on the soil and/or on undesired plants and/or the crop plants and/or their environment; and to a use of the tank mix adjuvant for increasing the efficacyl of a pesticide.

Abstract: A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.

Abstract: A chemical-mechanical polishing (“CMP”) composition (P) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of A/-heterocyclic compound as corrosion inhibitor, (C) at least one type of a further corrosion inhibitor selected from the group consisting of: (C1) an acetylene alcohol, and (C2) a salt or an adduct of (C2a) an amine, and (C2b) a carboxylic acid comprising an amide moiety, (D) at least one type of an oxidizing agent, (E) at least one type of a complexing agent, and (F) an aqueous medium.

Abstract: A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.

Abstract: A process for the manufacture of semiconductor devices is provided. The process comprises the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a polymer comprising at least one N-heterocycle, and (M) an aqueous medium and whereas Q1 has a pH of from 1.5 to 4.5.

Abstract: A chemical-mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a composite or mixture thereof, (B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z), wherein (Z) is a carboxylate (—COOR1), sulfonate (—SO3R2), sulfate (—O—SO3R3), phosphonate (—P(?O) (OR4)(OR5)), phosphate (—O—P(?O)(OR6)(OR7)), carboxylic acid (—COOH), sulfonic acid (—SO3H), sulfuric acid (—O—SO3—), phosphonic acid (—P(?O)(OH)2), phosphoric acid (—O—P(?O)(OH)2) moiety, or their deprotonated forms, R1 is alkyl, aryl, alkylaryl, or arylalkyl R2 is alkyl, aryl, alkylaryl, or arylalkyl, R3 is alkyl, aryl, alkylaryl, or arylalkyl, R4 is alkyl, aryl, alkylaryl, or arylalkyl, R5 is H, alkyl, aryl, alkylaryl, or arylalkyl, R6 is alkyl, aryl, alkylaryl, or arylalkyl, R7 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.

Abstract: An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and N?-hydroxy-diazenium oxide salts; and (B) at least one type of abrasive particles; the use of the compounds (A) for manufacturing electrical, mechanical and optical devices and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

Abstract: Aqueous dispersion comprising cerium oxide and silicon dioxide, obtainable by first mixing a cerium oxide starting dispersion and a silicon dioxide starting dispersion while stirring, and then dispersing at a shear rate of 10000 to 30000 s?1, wherein a) the cerium oxide starting dispersion—contains 0.5 to 30% by weight of cerium oxide particles as the solid phase, —a d5o of the particle size distribution of 10 to 100 nm—and has a pH of 1 to 7, and b) the silicon dioxide starting dispersion—contains 0.1 to 30% by weight of colloidal silicon dioxide particles as the solid phase, has a d5o of the particle size distribution of 3 to 50 nm and has a pH of 6 to 11.5, d) with the proviso that the d5o of the particle size distribution of the cerium oxide particles is greater than that of the silicon dioxide particles, the cerium oxide/silicon dioxide weight ratio is >1 and the amount of cerium oxide starting dispersion is such that the zeta potential of the dispersion is negative.

Abstract: A process for preparing a paraffin inhibitor formulation comprising (a) preparing a mixture comprising a waxy paraffin inhibitor component having a melting point of >0° C. and an emulsifier component, wherein the mixture is prepared at a first temperature range above the melting point of the waxy paraffin inhibitor; (b) adding water to the mixture to produce an o/w emulsion; and (c) cooling the o/w emulsion to a temperature in a second temperature range which is below the melting point of the waxy paraffin inhibitor. The mixture prepared in step (a) may further comprise water to produce a w/o emulsion, the water being present in a proportion by weight that is lower than the sum of the proportions by weight of the paraffin inhibitor and the emulsifier component. The process may further comprise (d) adding an at least partially water-miscible organic solvent in which the paraffin inhibitor is insoluble.

Abstract: A metal stamping component for a vehicle transmission system which is produced by a novel progressive tool design with enhanced performance and economic characteristics over conventional manufacturing methods.