Abstract: A nanopillar photonic crystal laser includes a plurality of nanopillars and a support structure in contact with at least a portion of each of the nanopillars. Each nanopillar has an axial dimension and two mutually orthogonal cross dimensions. The axial dimension of each of the nanopillars is greater than the two mutually orthogonal cross dimensions, where there mutually orthogonal cross dimensions are less than about 1 ?m and greater than about 1 nm. The support structure holds the plurality of nanopillars in preselected relative orientations and displacements relative to each other to form an array pattern that confines light of a preselected wavelength to a resonance region that intercepts at least one nanopillar of the plurality of nanopillars. The at least one nanopillar includes a lasing material to provide an output laser beam of light at the preselected wavelength.

Abstract: A nanopillar photonic crystal laser includes a plurality of nanopillars and a support structure in contact with at least a portion of each of the nanopillars. Each nanopillar has an axial dimension and two mutually orthogonal cross dimensions. The axial dimension of each of the nanopillars is greater than the two mutually orthogonal cross dimensions, where there mutually orthogonal cross dimensions are less than about 1 ?m and greater than about 1 nm. The support structure holds the plurality of nanopillars in preselected relative orientations and displacements relative to each other to form an array pattern that confines light of a preselected wavelength to a resonance region that intercepts at least one nanopillar of the plurality of nanopillars. The at least one nanopillar includes a lasing material to provide an output laser beam of light at the preselected wavelength.

Abstract: A plasmonically enhanced electro-optic device includes a dielectric layer; a plurality of nanopillars arranged in a periodic array such that each nanopillar has a protruding portion that extends beyond a surface of the dielectric layer; a metallic layer formed on the surface of the dielectric layer and on portions of the plurality of nanopillars by an oblique directional deposition such that the metallic layer defines a periodic array of nano-holes and nano-antennas, each nano-hole of the periodic array of nano-holes being in a deposition shadow region of a corresponding nanopillar; and an electrode electrically connected to at least one nanopillar of the plurality of nanopillars at an end opposing the protruding portion thereof.

Abstract: An axially hetero-structured nanowire includes a first segment that includes GaAs, and a second segment integral with the first that includes InxGa1-xAs. The parameter x has a maximum value x-max within the second segment that is at least 0.02 and less than 0.5. A nanostructured semiconductor component includes a GaAs (111)B substrate, and a plurality of nanopillars integral with the substrate at an end thereof. Each of the plurality of nanopillars can be a nanowire according to an embodiment of the current invention. A method of producing axially hetero-structured nanowires is also provided.

Abstract: Exemplary embodiments provide a semiconductor fabrication method including a combination of monolithic integration techniques with wafer bonding techniques. The resulting semiconductor devices can be used in a wide variety of opto-electronic and/or electronic applications such as lasers, light emitting diodes (LEDs), phototvoltaics, photodetectors and transistors. In an exemplary embodiment, the semiconductor device can be formed by first forming an active-device structure including an active-device section disposed on a thinned III-V substrate. The active-device section can include OP and/or EP VCSEL devices. A high-quality monolithic integration structure can then be formed with low defect density through an interfacial misfit dislocation. In the high-quality monolithic integration structure, a thinned III-V mating layer can be formed over a silicon substrate.

Abstract: Embodiments provide a quantum dot active structure and a methodology for its fabrication. The quantum dot active structure includes a substrate, a plurality of alternating regions of a quantum dot active region and a strain-compensation region, and a cap layer. The strain-compensation region is formed to eliminate the compressive strain of an adjacent quantum dot active region, thus allowing quantum dot active regions to be densely-stacked. The densely-stacked quantum dot active region provides increased optical modal gain for semiconductor light emitting devices such as edge emitting lasers, vertical cavity lasers, detectors, micro-cavity emitters, optical amplifiers or modulators.

Abstract: Exemplary embodiments provide high-quality layered semiconductor devices and methods for their fabrication. The high-quality layered semiconductor device can be formed in planar with low defect densities and with strain relieved through a plurality of arrays of misfit dislocations formed at the interface of highly lattice-mismatched layers of the device. The high-quality layered semiconductor device can be formed using various materials systems and can be incorporated into various opto-electronic and electronic devices. In an exemplary embodiment, a vertical cavity device can include two types of arrays of misfit dislocations to form high-quality semiconductor layers of the vertical cavity device. The vertical cavity device can be operated at a wavelength of about 1.6-5.0 ?m.

Abstract: A method for removing a mask in a selective area epitaxy process is provided. The method includes forming a first layer on a substrate and oxidizing the first layer. A patterned photoresist can be formed on the oxidized first layer. A portion of the oxidized first layer can then be removed using a wet chemical etch to form a mask. After removing the patterned photoresist a second layer can be epitaxially grown in a metal organic chemical vapor deposition (MOCVD) chamber or a chemical beam epitaxy (CBE) chamber on a portion of the first layer exposed by the mask. The mask can then be removed the mask in the MOCVD/MBE chamber. The disclosed in-situ mask removal method minimizes both the atmospheric exposure of a growth surface and the number of sample transfers.