Patents by Inventor Diana J. Williams

Diana J. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
    Patent number: 9918384
    Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: March 13, 2018
    Assignee: ROGERS CORPORATION
    Inventors: Dirk M. Baars, Dale J. Doyle, Sankar J. Paul, Diana J. Williams, Carlos L. Barton
  • DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF
    Publication number: 20140318698
    Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
    Type: Application
    Filed: July 11, 2014
    Publication date: October 30, 2014
    Inventors: Dirk M. Baars, Dale J. Doyle, Sankar J. Paul, Diana J. Williams, Carlos L. Barton
  • Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
    Patent number: 8809690
    Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: August 19, 2014
    Assignee: Rogers Corporation
    Inventors: Dirk M. Baars, Dale J. Doyle, Sankar J. Paul, Diana J. Williams, Carlos L. Barton
  • DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF
    Publication number: 20110214906
    Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
    Type: Application
    Filed: March 4, 2011
    Publication date: September 8, 2011
    Applicant: ROGERS CORPORATION
    Inventors: Dirk M. Baars, Dale J. Doyle, Sankar K. Paul, Diana J. Williams, Carlos L. Barton