Patents by Inventor Diana L. Hackenberg

Diana L. Hackenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Brushless multipass silicon wafer cleaning process for post chemical mechanical polishing using immersion
    Publication number: 20030121528
    Abstract: A method for removing a slurry from a silicon wafer after chemical-polishing whereby the wafer is subjected to at least 2 or more chemical megasonic baths for a short duration of time. The pH of the first megasonic bath matches the pH of the slurry to be removed.
    Type: Application
    Filed: February 5, 2003
    Publication date: July 3, 2003
    Applicant: Intersil Americas Inc.
    Inventor: Diana L. Hackenberg
  • Brushless multipass silicon wafer cleaning process for post chemical mechanical polishing using immersion
    Patent number: 6526995
    Abstract: A method for removing a slurry from a silicon wafer after chemical-polishing whereby the wafer is subjected to at least 2 or more chemical megasonic baths for a short duration of time. The pH of the first megasonic bath matches the pH of the slurry to be removed.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: March 4, 2003
    Assignee: Intersil Americas Inc.
    Inventor: Diana L. Hackenberg
  • Apparatus and method for sampling ultra-pure chemical
    Patent number: 5237878
    Abstract: An ultra-pure chemical sampling apparatus has an elongated sampling tube which is lowered into the liquid to obtain samples of the chemical. The sampling tube extends the depth of the liquid and holes arranged along the tube provides for a representative sample to be obtained at different depths. The sampling tube is coupled to a collection bottle by a tubing of which a section of flexible tubing is coupled to a peristaltic pump to pump the liquid up the sampling tube, through the tubing and into the collection bottle. A cap is used to seal the sampling tube and a secondary containment receptacle is used to enclose the bottle in order to inhibit the escape of chemical fumes which could harm the environment or the person obtaining the sample.
    Type: Grant
    Filed: November 24, 1992
    Date of Patent: August 24, 1993
    Assignee: Sematech, Inc.
    Inventor: Diana L. Hackenberg