Patents by Inventor Diana URICH

Diana URICH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Projection exposure system for semiconductor lithography, comprising elements for plasma conditioning
    Patent number: 10712677
    Abstract: A projection exposure apparatus (400) for semiconductor lithography contains at least one partial volume (4) that is closed off from the surroundings. The partial volume (4) contains a gas, from which a plasma can be produced. Conditioning elements (20, 21, 22, 23, 24, 25) for conditioning the plasma, in particular for neutralizing the plasma, are present in the partial volume. An associated method for operating a projection exposure apparatus is also disclosed.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: July 14, 2020
    Assignee: CARL ZEISS SMT GMBH
    Inventors: Irene Ament, Dirk Heinrich Ehm, Stefan Wolfgang Schmidt, Moritz Becker, Stefan Wiesner, Diana Urich
  • Reflective optical element for EUV lithography
    Patent number: 10649340
    Abstract: In order to prevent delamination of a reflective coating from the substrate under the influence of reactive hydrogen, a reflective optical element (50) for EUV lithography is provided, which has a substrate (51) and a reflective coating (54) for reflecting radiation in the wavelength range of 5 nm to 20 nm. A functional layer (60) is arranged between the reflective coating (54) and the substrate (51). With the functional layer, the concentration of hydrogen in atom % at the side of the substrate facing the reflective coating is reduced by at least a factor of 2.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: May 12, 2020
    Assignee: CARL ZEISS SMT GMBH
    Inventors: Dirk Heinrich Ehm, Vitaliy Shklover, Irene Ament, Stefan-Wolfgang Schmidt, Moritz Becker, Stefan Wiesner, Diana Urich, Robert Meier, Ralf Winter, Christof Jalics, Holger Kierey, Eric Eva
  • PROJECTION EXPOSURE SYSTEM FOR SEMICONDUCTOR LITHOGRAPHY, COMPRISING ELEMENTS FOR PLASMA CONDITIONING
    Publication number: 20190243258
    Abstract: A projection exposure apparatus (400) for semiconductor lithography contains at least one partial volume (4) that is closed off from the surroundings. The partial volume (4) contains a gas, from which a plasma can be produced. Conditioning elements (20, 21, 22, 23, 24, 25) for conditioning the plasma, in particular for neutralizing the plasma, are present in the partial volume. An associated method for operating a projection exposure apparatus is also disclosed.
    Type: Application
    Filed: November 21, 2018
    Publication date: August 8, 2019
    Inventors: Irene AMENT, Dirk Heinrich EHM, Stefan Wolfgang SCHMIDT, Moritz BECKER, Stefan WIESNER, Diana Urich
  • REFLECTIVE OPTICAL ELEMENT FOR EUV LITHOGRAPHY
    Publication number: 20190171108
    Abstract: In order to prevent delamination of a reflective coating from the substrate under the influence of reactive hydrogen, a reflective optical element (50) for EUV lithography is provided, which has a substrate (51) and a reflective coating (54) for reflecting radiation in the wavelength range of 5 nm to 20 nm. A functional layer (60) is arranged between the reflective coating (54) and the substrate (51). With the functional layer, the concentration of hydrogen in atom % at the side of the substrate facing the reflective coating is reduced by at least a factor of 2.
    Type: Application
    Filed: January 25, 2019
    Publication date: June 6, 2019
    Inventors: Dirk Heinrich EHM, Vitaliy SHKLOVER, Irene AMENT, Stefan-Wolfgang SCHMIDT, Moritz BECKER, Stefan WIESNER, Diana URICH, Robert MEIER, Ralf WINTER, Christof JALICS, Holger KIEREY, Eric EVA