Patents by Inventor Diana Zhang
Diana Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250218115Abstract: A method includes receiving a three-dimensional (3D) avatar. The method further includes generating two-dimensional (2D) images of the 3D avatar from different angles that surround the 3D avatar. The method further includes providing the 2D images as input to a trained machine-learning model. The method further includes generating, with the machine-learning model, a concatenated embedding of the 2D images. The method further includes analyzing, with the machine-learning model based on the concatenated embedding, at least one attribute associated with the 3D avatar, wherein the at least one attribute is selected from a group of a shape of the 3D avatar, an outfit on the 3D avatar, and combinations thereof. The method further includes outputting, with the machine-learning model, a determination that the at least one attribute of the 3D avatar is abusive.Type: ApplicationFiled: October 30, 2024Publication date: July 3, 2025Applicant: Roblox CorporationInventors: Jessie DUAN, Chi Ming WONG, David LYU, Puneet JAIN, Tomo MICHIGAMI, Diana ZHANG, Ashish MALHOTRA
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Publication number: 20250125549Abstract: A connector terminal includes a terminal body and an electroplated component. The electroplated component includes a substrate layer and an electroplating layer. The substrate layer has a first and second surface opposite to each other in its thickness direction, wherein the first surface of the substrate layer is attached to a local area of the terminal body. The electroplating layer which formed on the second surface of the substrate layer for electrical contact with a mating terminal.Type: ApplicationFiled: October 10, 2024Publication date: April 17, 2025Applicant: Tyco Electronics (Shanghai) Co., Ltd.Inventors: Weidong Zhang, Daiqiong (Diana) Zhang, Lei Pan, Keke Gan
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Patent number: 12188143Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.Type: GrantFiled: January 29, 2022Date of Patent: January 7, 2025Assignees: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co.Inventors: Daiqiong (Diana) Zhang, Yuelin (Kevin) Liang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Zhongxi Huang
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Publication number: 20240240350Abstract: An electroplating device includes an electroplating pool containing an electroplating solution, a first anode plate immersed in the electroplating solution, and a first pulse rectifier having a positive electrode electrically connected to the first anode plate and a negative electrode electrically connected to a workpiece to be electroplated that is immersed in the electroplating solution. The first pulse rectifier periodically outputs a first set of pulse currents during electroplating of the workpiece. The first set of pulse currents includes a plurality of first different pulse currents that differ in a peak current density and a duty cycle.Type: ApplicationFiled: January 17, 2024Publication date: July 18, 2024Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co., Ltd.Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Jianhua Nie, Zhongpu (Johnson) Deng, Xunwei (Will) Zhu, Chunyan (Cherie) Zhou, Zhongxi Huang, Kefang Yuan
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Publication number: 20240191384Abstract: A preparation method of an electroplated part includes the steps of plating a porous metal coating layer, placing the porous metal coating layer in a graphite colloid, and depositing graphite colloidal particles into the porous metal coating layer. The porous metal coating layer is plated at or proximate an outer side of a substrate of the electroplated part. The graphite colloidal particles are deposited into pores of the porous metal coating layer from the graphite colloid to form a graphite alloy coating layer.Type: ApplicationFiled: December 12, 2023Publication date: June 13, 2024Applicant: Tyco Electronics (Shanghai) Co., Ltd.Inventors: Daiqiong (Diana) Zhang, Jialin Zhang, Wenzheng Ma, Weidong Zhang, Zhongxi Huang
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Publication number: 20240191387Abstract: A coating structure includes a substrate, a first metal layer, a second alloy layer, a third metal layer, and a fourth alloy layer. The first metal layer is plated on an outside of the substrate and does not include graphite. The second alloy layer is plated on an outside of the first metal layer and is synthesized from graphite and metal. The third metal layer is plated on an outside of the second alloy layer and does not include graphite. The fourth alloy layer is plated on an outside of the third metal layer and is also synthesized from graphite and metal.Type: ApplicationFiled: December 12, 2023Publication date: June 13, 2024Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics Technology (SIP) Ltd., Tyco Electronics (Shanghai) Co., Ltd.Inventors: Daiqiong (Diana) Zhang, Zhenyu (Julie) Zhu, Wenzheng Ma, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Weidong Zhang, Zhongxi Huang, Keke Gan
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Publication number: 20240145967Abstract: A conductive terminal includes a conductive base substrate and a plating layer structure plated on the conductive base substrate. The plating layer structure includes a nickel plating layer located outside the conductive base substrate, a silver plating layer located outside the nickel plating layer, and a platinum-based polymetallic plating layer located outside the silver plating layer.Type: ApplicationFiled: October 31, 2023Publication date: May 2, 2024Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Qingdao) Ltd.Inventors: Liming (Eric) Wang, Daiqiong (Diana) Zhang, Wende Zhao, Shilong Wu, Xinxin (Daisy) Li, Zhenyu (Richard) Chen, Jialin Zhang, Zhongxi Huang
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Publication number: 20230383413Abstract: A workpiece plating treatment method includes the steps of cleaning an outer surface of an outer plating layer of a workpiece to remove a plurality of oxides and dirt on the outer surface of the outer plating layer, and reflow melting the outer plating layer of the workpiece using a reflow melting device after the cleaning.Type: ApplicationFiled: May 24, 2023Publication date: November 30, 2023Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co., Ltd.Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Jianhua Nie, Zhongpu (Johnson) Deng, Chunyan (Cherie) Zhou, Zhenyu (Julie) Zhu, Julian Zhang, Zhongxi Huang
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Publication number: 20230381893Abstract: A workpiece plating treatment method includes the steps of providing a pulse laser having a plurality of different energy levels, adjusting the pulse laser to the plurality of different energy levels, and scanning a plating layer of a workpiece with the pulse laser at the plurality of different energy levels to effect different changes on the plating layer. The different energy levels include an activation energy level, a temperature rise energy level, a constant temperature energy level, a melting energy level, a cooling energy level, and a polishing energy level.Type: ApplicationFiled: May 24, 2023Publication date: November 30, 2023Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co., Ltd.Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Weidong Zhang, Jingjing (Justin) GU, Zhongxi Huang, Jingshu Gong
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Patent number: 11807953Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.Type: GrantFiled: January 29, 2022Date of Patent: November 7, 2023Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Yuelin (Kevin) Liang, Zhongxi Huang
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Publication number: 20220410033Abstract: A filter element includes a stirring device, a continuous adsorption carrier arranged around the stirring device, and a granular adsorption carrier filled between the continuous adsorption carrier and the stirring device. The stirring device stirs the granular adsorption carrier when filtering a liquid with the filter element.Type: ApplicationFiled: June 28, 2022Publication date: December 29, 2022Applicants: Tyco Electronics (Shanghai) Co. Ltd, Tyco Electronics (Suzhou) Ltd.Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Zhongxi Huang
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Publication number: 20220243350Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.Type: ApplicationFiled: January 29, 2022Publication date: August 4, 2022Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Yuelin (Kevin) Liang, Zhongxi Huang
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Publication number: 20220243355Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.Type: ApplicationFiled: January 29, 2022Publication date: August 4, 2022Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.Inventors: Daiqiong (Diana) Zhang, Yuelin (Kevin) Liang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Zhongxi Huang
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Publication number: 20220178041Abstract: A reflow melting system for reflow melting a metal coating on an electrical contact area of a terminal includes a laser head for emitting a laser light onto the metal coating on the terminal to heat and melt the metal coating. A remote control terminal is provided in communication with the laser head for adjusting at least one working parameter of the laser head for optimizing the melting effect of the metal coating.Type: ApplicationFiled: December 3, 2021Publication date: June 9, 2022Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Suzhou) Ltd.Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Jialin Zhang, Zhongxi Huang
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Patent number: 11139853Abstract: Described herein is a system that overcomes challenges pertaining to density and range of urban LP-WANs despite the limited capabilities of base station and client hardware. The invention proposes a novel technique that aims to disentangle and decode large numbers of interfering transmissions at a simple, single-antenna LP-WAN base station by exploiting the hardware imperfections of low-cost LP-WAN clients to its advantage Second, the present invention exploits the correlation of sensed data collected by LP-WAN nodes to collaboratively reach a far-away base station, even if individual clients are beyond its range.Type: GrantFiled: July 3, 2019Date of Patent: October 5, 2021Assignee: CARNEGIE MELLON UNIVERSITYInventors: Rashad Eletreby, Swarun Kumar, Osman Yagan, Diana Zhang
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Publication number: 20210234570Abstract: Described herein is a system that overcomes challenges pertaining to density and range of urban LP-WANs despite the limited capabilities of base station and client hardware. The invention proposes a novel technique that aims to disentangle and decode large numbers of interfering transmissions at a simple, single-antenna LP-WAN base station by exploiting the hardware imperfections of low-cost LP-WAN clients to its advantage. Second, the present invention exploits the correlation of sensed data collected by LP-WAN nodes to collaboratively reach a far-away base station, even if individual clients are beyond its range.Type: ApplicationFiled: July 3, 2019Publication date: July 29, 2021Inventors: Rashad ELETREBY, Swarun KUMAR, Osman YAGAN, Diana ZHANG
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Patent number: D884539Type: GrantFiled: October 3, 2018Date of Patent: May 19, 2020Assignee: Diana Zhang Jewelry Company LimitedInventor: Diana Zhang