Patents by Inventor Diana Zhang

Diana Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250218115
    Abstract: A method includes receiving a three-dimensional (3D) avatar. The method further includes generating two-dimensional (2D) images of the 3D avatar from different angles that surround the 3D avatar. The method further includes providing the 2D images as input to a trained machine-learning model. The method further includes generating, with the machine-learning model, a concatenated embedding of the 2D images. The method further includes analyzing, with the machine-learning model based on the concatenated embedding, at least one attribute associated with the 3D avatar, wherein the at least one attribute is selected from a group of a shape of the 3D avatar, an outfit on the 3D avatar, and combinations thereof. The method further includes outputting, with the machine-learning model, a determination that the at least one attribute of the 3D avatar is abusive.
    Type: Application
    Filed: October 30, 2024
    Publication date: July 3, 2025
    Applicant: Roblox Corporation
    Inventors: Jessie DUAN, Chi Ming WONG, David LYU, Puneet JAIN, Tomo MICHIGAMI, Diana ZHANG, Ashish MALHOTRA
  • Publication number: 20250125549
    Abstract: A connector terminal includes a terminal body and an electroplated component. The electroplated component includes a substrate layer and an electroplating layer. The substrate layer has a first and second surface opposite to each other in its thickness direction, wherein the first surface of the substrate layer is attached to a local area of the terminal body. The electroplating layer which formed on the second surface of the substrate layer for electrical contact with a mating terminal.
    Type: Application
    Filed: October 10, 2024
    Publication date: April 17, 2025
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Weidong Zhang, Daiqiong (Diana) Zhang, Lei Pan, Keke Gan
  • Patent number: 12188143
    Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.
    Type: Grant
    Filed: January 29, 2022
    Date of Patent: January 7, 2025
    Assignees: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co.
    Inventors: Daiqiong (Diana) Zhang, Yuelin (Kevin) Liang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Zhongxi Huang
  • Publication number: 20240240350
    Abstract: An electroplating device includes an electroplating pool containing an electroplating solution, a first anode plate immersed in the electroplating solution, and a first pulse rectifier having a positive electrode electrically connected to the first anode plate and a negative electrode electrically connected to a workpiece to be electroplated that is immersed in the electroplating solution. The first pulse rectifier periodically outputs a first set of pulse currents during electroplating of the workpiece. The first set of pulse currents includes a plurality of first different pulse currents that differ in a peak current density and a duty cycle.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Jianhua Nie, Zhongpu (Johnson) Deng, Xunwei (Will) Zhu, Chunyan (Cherie) Zhou, Zhongxi Huang, Kefang Yuan
  • Publication number: 20240191384
    Abstract: A preparation method of an electroplated part includes the steps of plating a porous metal coating layer, placing the porous metal coating layer in a graphite colloid, and depositing graphite colloidal particles into the porous metal coating layer. The porous metal coating layer is plated at or proximate an outer side of a substrate of the electroplated part. The graphite colloidal particles are deposited into pores of the porous metal coating layer from the graphite colloid to form a graphite alloy coating layer.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 13, 2024
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Daiqiong (Diana) Zhang, Jialin Zhang, Wenzheng Ma, Weidong Zhang, Zhongxi Huang
  • Publication number: 20240191387
    Abstract: A coating structure includes a substrate, a first metal layer, a second alloy layer, a third metal layer, and a fourth alloy layer. The first metal layer is plated on an outside of the substrate and does not include graphite. The second alloy layer is plated on an outside of the first metal layer and is synthesized from graphite and metal. The third metal layer is plated on an outside of the second alloy layer and does not include graphite. The fourth alloy layer is plated on an outside of the third metal layer and is also synthesized from graphite and metal.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 13, 2024
    Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics Technology (SIP) Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Daiqiong (Diana) Zhang, Zhenyu (Julie) Zhu, Wenzheng Ma, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Weidong Zhang, Zhongxi Huang, Keke Gan
  • Publication number: 20240145967
    Abstract: A conductive terminal includes a conductive base substrate and a plating layer structure plated on the conductive base substrate. The plating layer structure includes a nickel plating layer located outside the conductive base substrate, a silver plating layer located outside the nickel plating layer, and a platinum-based polymetallic plating layer located outside the silver plating layer.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Qingdao) Ltd.
    Inventors: Liming (Eric) Wang, Daiqiong (Diana) Zhang, Wende Zhao, Shilong Wu, Xinxin (Daisy) Li, Zhenyu (Richard) Chen, Jialin Zhang, Zhongxi Huang
  • Publication number: 20230383413
    Abstract: A workpiece plating treatment method includes the steps of cleaning an outer surface of an outer plating layer of a workpiece to remove a plurality of oxides and dirt on the outer surface of the outer plating layer, and reflow melting the outer plating layer of the workpiece using a reflow melting device after the cleaning.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 30, 2023
    Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Jianhua Nie, Zhongpu (Johnson) Deng, Chunyan (Cherie) Zhou, Zhenyu (Julie) Zhu, Julian Zhang, Zhongxi Huang
  • Publication number: 20230381893
    Abstract: A workpiece plating treatment method includes the steps of providing a pulse laser having a plurality of different energy levels, adjusting the pulse laser to the plurality of different energy levels, and scanning a plating layer of a workpiece with the pulse laser at the plurality of different energy levels to effect different changes on the plating layer. The different energy levels include an activation energy level, a temperature rise energy level, a constant temperature energy level, a melting energy level, a cooling energy level, and a polishing energy level.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 30, 2023
    Applicants: Tyco Electronics (Suzhou) Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Weidong Zhang, Jingjing (Justin) GU, Zhongxi Huang, Jingshu Gong
  • Patent number: 11807953
    Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.
    Type: Grant
    Filed: January 29, 2022
    Date of Patent: November 7, 2023
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Yuelin (Kevin) Liang, Zhongxi Huang
  • Publication number: 20220410033
    Abstract: A filter element includes a stirring device, a continuous adsorption carrier arranged around the stirring device, and a granular adsorption carrier filled between the continuous adsorption carrier and the stirring device. The stirring device stirs the granular adsorption carrier when filtering a liquid with the filter element.
    Type: Application
    Filed: June 28, 2022
    Publication date: December 29, 2022
    Applicants: Tyco Electronics (Shanghai) Co. Ltd, Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Dongqing (Gates) Peng, Zhongxi Huang
  • Publication number: 20220243350
    Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.
    Type: Application
    Filed: January 29, 2022
    Publication date: August 4, 2022
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Yuelin (Kevin) Liang, Zhongxi Huang
  • Publication number: 20220243355
    Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.
    Type: Application
    Filed: January 29, 2022
    Publication date: August 4, 2022
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Yuelin (Kevin) Liang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Zhongxi Huang
  • Publication number: 20220178041
    Abstract: A reflow melting system for reflow melting a metal coating on an electrical contact area of a terminal includes a laser head for emitting a laser light onto the metal coating on the terminal to heat and melt the metal coating. A remote control terminal is provided in communication with the laser head for adjusting at least one working parameter of the laser head for optimizing the melting effect of the metal coating.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 9, 2022
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Jialin Zhang, Zhongxi Huang
  • Patent number: 11139853
    Abstract: Described herein is a system that overcomes challenges pertaining to density and range of urban LP-WANs despite the limited capabilities of base station and client hardware. The invention proposes a novel technique that aims to disentangle and decode large numbers of interfering transmissions at a simple, single-antenna LP-WAN base station by exploiting the hardware imperfections of low-cost LP-WAN clients to its advantage Second, the present invention exploits the correlation of sensed data collected by LP-WAN nodes to collaboratively reach a far-away base station, even if individual clients are beyond its range.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 5, 2021
    Assignee: CARNEGIE MELLON UNIVERSITY
    Inventors: Rashad Eletreby, Swarun Kumar, Osman Yagan, Diana Zhang
  • Publication number: 20210234570
    Abstract: Described herein is a system that overcomes challenges pertaining to density and range of urban LP-WANs despite the limited capabilities of base station and client hardware. The invention proposes a novel technique that aims to disentangle and decode large numbers of interfering transmissions at a simple, single-antenna LP-WAN base station by exploiting the hardware imperfections of low-cost LP-WAN clients to its advantage. Second, the present invention exploits the correlation of sensed data collected by LP-WAN nodes to collaboratively reach a far-away base station, even if individual clients are beyond its range.
    Type: Application
    Filed: July 3, 2019
    Publication date: July 29, 2021
    Inventors: Rashad ELETREBY, Swarun KUMAR, Osman YAGAN, Diana ZHANG
  • Patent number: D884539
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 19, 2020
    Assignee: Diana Zhang Jewelry Company Limited
    Inventor: Diana Zhang