Patents by Inventor Diane Dai

Diane Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7190217
    Abstract: In one embodiment, ground separation is provided between first and second grounded environments by configuring first and second op-amps of the second grounded environment as buffers, configuring a third op-amp of the second grounded environment to output a difference of its inputs, and coupling the inputs of the third op-amp to outputs of the first and second op-amps. A signal sensing input of each of the first and second op-amps is biased by 1) coupling the signal sensing input to a respective one of first and second impedances, and 2) coupling the first and second impedances to a ground of the first grounded environment. A signal from the first grounded environment is then provided to the signal sensing input of the first op-amp. Related apparatus is also disclosed.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: March 13, 2007
    Assignee: Verigy Pte. Ltd.
    Inventor: Diane Dai
  • Publication number: 20060103461
    Abstract: In one embodiment, ground separation is provided between first and second grounded environments by configuring first and second op-amps of the second grounded environment as buffers, configuring a third op-amp of the second grounded environment to output a difference of its inputs, and coupling the inputs of the third op-amp to outputs of the first and second op-amps. A signal sensing input of each of the first and second op-amps is biased by 1) coupling the signal sensing input to a respective one of first and second impedances, and 2) coupling the first and second impedances to a ground of the first grounded environment. A signal from the first grounded environment is then provided to the signal sensing input of the first op-amp. Related apparatus is also disclosed.
    Type: Application
    Filed: November 15, 2004
    Publication date: May 18, 2006
    Inventor: Diane Dai