Patents by Inventor Diane LANCASTER

Diane LANCASTER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088143
    Abstract: Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described. In an example, an integrated circuit structure includes a semiconductor fin having a cut along a length of the semiconductor fin. A gate endcap isolation structure has a first portion parallel with the length of the semiconductor fin and is spaced apart from the semiconductor fin. The gate endcap isolation structure also has a second portion in a location of the cut of the semiconductor fin and in contact with the semiconductor fin.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Szuya S. Liao, Scott B. CLENDENNING, Jessica TORRES, Lukas BAUMGARTEL, Kiran CHIKKADI, Diane LANCASTER, Matthew V. METZ, Florian GSTREIN, Martin M. MITAN, Rami HOURANI
  • Patent number: 11869889
    Abstract: Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described. In an example, an integrated circuit structure includes a semiconductor fin having a cut along a length of the semiconductor fin. A gate endcap isolation structure has a first portion parallel with the length of the semiconductor fin and is spaced apart from the semiconductor fin. The gate endcap isolation structure also has a second portion in a location of the cut of the semiconductor fin and in contact with the semiconductor fin.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: January 9, 2024
    Assignee: Intel Corporation
    Inventors: Szuya S. Liao, Scott B. Clendenning, Jessica Torres, Lukas Baumgartel, Kiran Chikkadi, Diane Lancaster, Matthew V. Metz, Florian Gstrein, Martin M. Mitan, Rami Hourani
  • Publication number: 20230197817
    Abstract: Gate-all-around integrated circuit structures having confined epitaxial source or drain structures, are described. For example, an integrated circuit structure includes a plurality of nanowires above a sub-fin. A gate stack is over the plurality of nanowires and the sub-fin. Epitaxial source or drain structures are on opposite ends of the plurality of nanowires. The epitaxial source or drain structures comprise i) a first PMOS epitaxial (pEPI) region of germanium and boron, ii) a second pEPI region of silicon, germanium and boron on the first pEPI region at a contact location, iii) titanium silicide conductive contact material on the second pEPI region.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventors: Debaleena NANDI, Cory BOMBERGER, Diane LANCASTER, Gilbert DEWEY, Sandeep K. PATIL, Mauro J. KOBRINSKY, Anand S. MURTHY, Tahir GHANI
  • Publication number: 20210091075
    Abstract: Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described. In an example, an integrated circuit structure includes a semiconductor fin having a cut along a length of the semiconductor fin. A gate endcap isolation structure has a first portion parallel with the length of the semiconductor fin and is spaced apart from the semiconductor fin. The gate endcap isolation structure also has a second portion in a location of the cut of the semiconductor fin and in contact with the semiconductor fin.
    Type: Application
    Filed: September 23, 2019
    Publication date: March 25, 2021
    Inventors: Szuya S. LIAO, Scott B. CLENDENNING, Jessica TORRES, Lukas BAUMGARTEL, Kiran CHIKKADI, Diane LANCASTER, Matthew V. METZ, Florian GSTREIN, Martin M. MITAN, Rami HOURANI