Patents by Inventor Diane Louise Arbuthnot

Diane Louise Arbuthnot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable cross-section plated mushroom with stud for bumping
    Patent number: 6940167
    Abstract: An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: September 6, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Gonzalo Amador, Diane Louise Arbuthnot
  • Variable cross-section plated mushroom with stud for bumping
    Publication number: 20040175879
    Abstract: An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 9, 2004
    Inventors: Gonzalo Amador, Diane Louise Arbuthnot
  • Variable cross-section plated mushroom with stud for bumping
    Patent number: 6750134
    Abstract: An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: June 15, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Gonzalo Amador, Diane Louise Arbuthnot
  • Variable cross-section plated mushroom with stud for bumping
    Publication number: 20030129823
    Abstract: An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
    Type: Application
    Filed: January 9, 2003
    Publication date: July 10, 2003
    Inventors: Gonzalo Amador, Diane Louise Arbuthnot