Abstract: A server chassis, including: a first compartment configured to receive one or more central electronics complexes (‘CECs’); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.

Abstract: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

Abstract: A server chassis, including: a first compartment configured to receive one or more central electronics complexes (‘CECs’); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.

Abstract: An electronic system comprises: at least one electronic component; a cooling system condition receiver, wherein the cooling system condition receiver is capable of receiving a condition signal, and wherein the condition signal describes a current condition of a cooling system that provides conditioned air to an ambient environment of the electronic system; and a throttle, wherein the throttle, in response to the cooling system condition receiver receiving the condition signal that describes the current condition of the cooling system, adjusts an amount of heat generated by said at least one electronic component by throttling back operations of said at least one electronic component.

Abstract: A computer program product including computer usable program code embodied on a computer usable medium for controlling a temperature within a computer system using a fan. The computer program product includes computer usable program code for monitoring the temperature within the computer system; dynamically selecting a fan speed step in response to the temperature, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed; operating a fan at the dynamically selected fan speed step; measuring a fan output variation is measured over a prescribed time interval; and automatically modifying the fan speed table to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan.

Abstract: A computer-implemented fan control method includes measuring a temperature within a computer system and dynamically selecting a fan speed step in response to the temperature received, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed. A fan is operated at the dynamically selected fan speed step, wherein the fan is positioned to drive air through the computer system where the temperature is being measured. The fan output variation is measured over a prescribed time interval and the fan speed table is automatically modified to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan.

Abstract: A computer program product including computer usable program code embodied on a computer usable medium for controlling a temperature within a computer system using a fan. The computer program product includes computer usable program code for monitoring the temperature within the computer system; dynamically selecting a fan speed step in response to the temperature, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed; operating a fan at the dynamically selected fan speed step; measuring a fan output variation is measured over a prescribed time interval; and automatically modifying the fan speed table to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan.

Abstract: A computer-implemented fan control method includes measuring a temperature within a computer system and dynamically selecting a fan speed step in response to the temperature received, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed. A fan is operated at the dynamically selected fan speed step, wherein the fan is positioned to drive air through the computer system where the temperature is being measured. The fan output variation is measured over a prescribed time interval and the fan speed table is automatically modified to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan.

Abstract: A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode.

Abstract: A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.

Abstract: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

Abstract: A computer system has a plurality of heat-generating computer devices arranged in a data center, a cooling system in the data center, and a real-time cooling controller. The cooling system is configured for directing a cooling fluid to a plurality of different zones of the computer system, where each zone is occupied by a different subset of the heat-generating devices. The real-time cooling controller is configured for monitoring a power consumption of the heat-generating devices at each zone, independently controlling a cooling fluid flow rate to each zone, targeting one of the zones for increased cooling in response to a detected increase in the power consumption at the targeted zone, and increasing the cooling fluid flow rate to the targeted zone in immediate response to the power consumption increase.

Abstract: One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening through which the boss protrudes at least slightly beyond the cross-member. The heat sink may be secured to a socket on a circuit board, with the boss engaging a processor positioned in the socket. In response to securing the heat sink, the boss compresses flush with the cross-member and the cross-member engages the processor to seat the processor in the socket. The opening in the cross-member reinforces the boss against outward deformation.

Abstract: One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening through which the boss protrudes at least slightly beyond the cross-member. The heat sink may be secured to a socket on a circuit board, with the boss engaging a processor positioned in the socket. In response to securing the heat sink, the boss compresses flush with the cross-member and the cross-member engages the processor to seat the processor in the socket. The opening in the cross-member reinforces the boss against outward deformation.