Patents by Inventor Diane Scott

Diane Scott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11748733
    Abstract: A Person-to-person payments method and system may include receiving a request from a computer network to transfer funds from a first account to a second account, almost instantly. An alias (mobile number or email) is received and is associated with the second account and checked against a database. If the alias exists, multiple options may apply for transferring funds. Next, a secure party identifier is generated and the transfer may be completed. A Payments Switch Module may also communicate with a Third Party Payment Service Provider a request from a Sending or Receiving Financial Institution or party, to send or receive funds from a specific account held by the Third Party Payment Service Provider. This may occur on an adhoc, automatic, or scheduled basis enabling management of ‘personal cash concentration.’ This feature with the Third Party Payment Service Provider be characterized as a “Bring it Home” feature of the system.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: September 5, 2023
    Assignee: PANTHER PAYMENTS, LLC
    Inventors: Mark Wilson, Rod Springhetti, Diane Scott
  • Patent number: 11663639
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: May 30, 2023
    Assignee: The Western Union Company
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran
  • Patent number: 11440158
    Abstract: Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: September 13, 2022
    Assignee: CMC Materials, Inc.
    Inventors: Diane Scott, Paul Andre Lefevre
  • Publication number: 20210272175
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 2, 2021
    Applicant: The Western Union Company
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran
  • Patent number: 10984459
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: April 20, 2021
    Assignee: The Western Union Company
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran
  • Patent number: 10946495
    Abstract: Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: March 16, 2021
    Assignee: CMC Materials, Inc.
    Inventors: Ping Huang, William C. Allison, Richard Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott
  • Publication number: 20210049577
    Abstract: A Person-to-person payments method and system may include receiving a request from a computer network to transfer funds from a first account to a second account, almost instantly. An alias (mobile number or email) is received and is associated with the second account and checked against a database. If the alias exists, multiple options may apply for transferring funds. Next, a secure party identifier is generated and the transfer may be completed. A Payments Switch Module may also communicate with a Third Party Payment Service Provider a request from a Sending or Receiving Financial Institution or party, to send or receive funds from a specific account held by the Third Party Payment Service Provider. This may occur on an adhoc, automatic, or scheduled basis enabling management of ‘personal cash concentration.’ This feature with the Third Party Payment Service Provider be characterized as a “Bring it Home” feature of the system.
    Type: Application
    Filed: May 11, 2018
    Publication date: February 18, 2021
    Inventors: Mark Wilson, Rod Springhetti, Diane Scott
  • Publication number: 20190370763
    Abstract: A system for transferring funds from a sender to a recipient with a recorded message is disclosed. In one step the method includes receiving a request for a fund transfer from the sender. The sender may make the request for a fund transfer at a transaction processing device. In another step a payment is received from the sender for the fund transfer and a payment confirmation is transmitted to the host computer system. An identifier may then be assigned to the fund transfer. A recorded message from the sender may be received and at least a copy of the recorded message may be transmitted to a host computer system. The recorded message may then be associated with the fund transfer. A request, including the identifier, may be received from the recipient to receive the recorded messaged. In another step the recorded message may be sent to the recipient.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 5, 2019
    Applicant: The Western Union Company
    Inventors: Scott Paintin, Lance Marr, Michelle Kloosterman, Rebecca Loevenguth, Diane Scott
  • Patent number: 10311410
    Abstract: A system for transferring funds from a sender to a recipient with a recorded message is disclosed. In one step the method includes receiving a request for a fund transfer from the sender. The sender may make the request for a fund transfer at a transaction processing device. In another step a payment is received from the sender for the fund transfer and a payment confirmation is transmitted to the host computer system. An identifier may then be assigned to the fund transfer. A recorded message from the sender may be received and at least a copy of the recorded message may be transmitted to a host computer system. The recorded message may then be associated with the fund transfer. A request, including the identifier, may be received from the recipient to receive the recorded messaged. In another step the recorded message may be sent to the recipient.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: June 4, 2019
    Assignee: The Western Union Company
    Inventors: Scott Paintin, Lance Marr, Michelle Kloosterman, Rebecca Loevenguth, Diane Scott
  • Patent number: 10293459
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: May 21, 2019
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • Publication number: 20190122276
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 25, 2019
    Applicant: The Western Union Company
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran
  • Patent number: 10235704
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: March 19, 2019
    Assignee: The Western Union Company
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran
  • Patent number: 10160092
    Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 25, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • Publication number: 20180336542
    Abstract: A Person-to-person payments method and system may include receiving a request from a computer network to transfer funds from a first account to a second account, almost instantly. An alias (mobile number or email) is received and is associated with the second account and checked against a database. If the alias exists, multiple options may apply for transferring funds. Next, a secure party identifier is generated and the transfer may be completed. A Payments Switch Module may also communicate with a Third Party Payment Service Provider a request from a Sending or Receiving Financial Institution or party, to send or receive funds from a specific account held by the Third Party Payment Service Provider. This may occur on an adhoc, automatic, or scheduled basis enabling management of ‘personal cash concentration.’ This feature with the Third Party Payment Service Provider be characterized as a “Bring it Home” feature of the system.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 22, 2018
    Inventors: Mark Wilson, Rod Springhetti, Diane Scott
  • Patent number: 10102571
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: October 16, 2018
    Assignee: THE WESTERN UNION COMPANY
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran
  • Publication number: 20180141183
    Abstract: Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.
    Type: Application
    Filed: January 19, 2018
    Publication date: May 24, 2018
    Inventors: Diane SCOTT, Paul Andre LEFEVRE
  • Patent number: 9931729
    Abstract: Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: April 3, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Diane Scott, James P. LaCasse
  • Patent number: 9931728
    Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: April 3, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson
  • Patent number: 9868185
    Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: January 16, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Diane Scott, Jose Arno
  • Publication number: 20170270605
    Abstract: The present invention provides systems and methods for tracking obligations incurred between individuals. The method may include receiving a request from a first party, where the request includes an expense incurred by the first party for the benefit of a second party. The method may also include providing a notice of the request to the second party and receiving an acceptance from the second party to assume an obligation associated with the expense. The method may further include associating the obligation with the second party and associating a benefit with the first party. The obligation and/or benefit may be substantially equal in value to the expense. The method may additionally include interfacing with a social network service to provide the social network service with information about the obligation and/or the benefit.
    Type: Application
    Filed: June 7, 2017
    Publication date: September 21, 2017
    Applicant: The Western Union Company
    Inventors: Michele Demark, Michael Michelsen, Diane Scott, Chris Cochran