Patents by Inventor Dianfeng WU

Dianfeng WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-insulation device and electronic product
    Patent number: 11229130
    Abstract: A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: January 18, 2022
    Assignee: ZTE Corporation
    Inventor: Dianfeng Wu
  • HEAT-INSULATION DEVICE AND ELECTRONIC PRODUCT
    Publication number: 20210045257
    Abstract: A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.
    Type: Application
    Filed: February 1, 2019
    Publication date: February 11, 2021
    Inventor: Dianfeng WU