Patents by Inventor Dianjun Gong

Dianjun Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110198014
    Abstract: The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances.
    Type: Application
    Filed: April 29, 2011
    Publication date: August 18, 2011
    Applicant: SAE Magnetics (H.K.) Ltd
    Inventors: Wingkeung MAK, Tinhoi Siu, Xiaoxi Liu, Gamboa Guillen, Dianjun Gong, Wei Si
  • Publication number: 20100200147
    Abstract: The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned.
    Type: Application
    Filed: July 23, 2009
    Publication date: August 12, 2010
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu, Xiaoxi Liu, Gamboa Guillen, Dianjun Gong, Wei Si