Patents by Inventor DiAnn J. Beesch

DiAnn J. Beesch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device having self-aligning solder pad design
    Patent number: 6084782
    Abstract: A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during a reflow operation.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: July 4, 2000
    Assignee: Motorola, Inc.
    Inventors: Due Huynh, Diann J. Beesch, Todd L. Smith
  • Method and apparatus for attachment of edge connector to substrate
    Patent number: 5609490
    Abstract: A method and apparatus attach a connector (17) to an edge (32) of a substrate (18) such that an electrical connection is formed between the circuits on the substrate (18) and the leads (12, 14) on the connector (17). A connector (17) is provided having leads arranged into a top row (12) and a bottom row (14) extending horizontally therefrom. A substrate (18) is provided having a row of solder bumps (20) on a bottom side to correspond with the bottom row of leads (14) of the connector (17) and a row of solder paste pads (22) on a top side to correspond with the top row of leads (12) of the connector (17). The edge (32) of the substrate (18) is approached with the connector (17) at an angle, straddling the edge (32) with the top row (12) and the bottom row (14) of leads, and rotating the connector (17) into parallel alignment with the substrate (18).
    Type: Grant
    Filed: February 22, 1995
    Date of Patent: March 11, 1997
    Assignee: Motorola, Inc.
    Inventors: DiAnn J. Beesch, Duane J. Enck, Janet Dieb