Patents by Inventor Diasuke NAKAJIMA

Diasuke NAKAJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SHAPE-FORMING PACKAGING MATERIAL, AND METHOD FOR PRODUCING POWER STORAGE DEVICE WITH SURFACE PRINTING
    Publication number: 20180233712
    Abstract: The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.
    Type: Application
    Filed: February 9, 2018
    Publication date: August 16, 2018
    Applicant: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Yuji MINAMIBORI, Diasuke NAKAJIMA