Abstract: An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture. Alternatively, an LED device and method of manufacture include coupling a rigid circuit board to an LED die such that electrical contacts of the die are electrically coupled with electrical input/output terminals of the circuit board. This die/board unit is then able to be coupled to a heat sink structure to form a portion of the device.

Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.

Abstract: A method of and a system for making LED comprising concurrently forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, attaching dies to the silicon wafer inside each of the dam structure, performing flux reflow, cleaning flux, performing wire bonding, dispensing phosphor, curing the phosphor, concurrently forming dome structures by using a liquid transfer mold on all of the dam structures, mounting wafer, and using a saw for single or multiple LED(s) singulation.

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract: An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture. Alternatively, an LED device and method of manufacture include coupling a rigid circuit board to an LED die such that electrical contacts of the die are electrically coupled with electrical input/output terminals of the circuit board. This die/board unit is then able to be coupled to a heat sink structure to form a portion of the device.

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract: A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted.

Abstract: A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.

Abstract: A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted.