Patents by Inventor Didier Arnoux

Didier Arnoux has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7994235
    Abstract: A method of a seamless model free of bond lines. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modelling paste to a structure support in the form of a continuous layer, curing the applied modelling paste, and machining the cured layer of modelling paste to the desired contour. The modelling paste a low density curable composition prepared from thixotropic epoxy or polyurethane containing microballoons.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: August 9, 2011
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Matthew Cleaver, Didier Arnoux
  • Publication number: 20100164134
    Abstract: A method of a seamless model free of bond lines. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modelling paste to a structure support in the form of a continuous layer, curing the applied modelling paste, and machining the cured layer of modelling paste to the desired contour. The modelling paste a low density curable composition prepared from thixotropic epoxy or polyurethane containing microballoons.
    Type: Application
    Filed: March 11, 2010
    Publication date: July 1, 2010
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Matthew Cleaver, Didier Arnoux
  • Patent number: 7704424
    Abstract: A method of a seamless model free of bond lines. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modelling paste to a structure support in the form of a continuous layer, curing the applied modelling paste, and machining the cured layer of modelling paste to the desired contour. The modelling paste a low density curable composition prepared from thixotropic epoxy or polyurethane containing microballoons.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: April 27, 2010
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Matthew Cleaver, Didier Arnoux
  • Patent number: 6602936
    Abstract: The present invention relates to compositions comprising A composition comprising (a) a resin containing a polyepoxide and a polyisocyanate, and (b) a treated filler which is either a silane-treated filler or an atomised filler, The compositions are suitable for the fabrication of high performance resin molds which can then be used for various molding methods such as injection molding, press molding, vacuum molding, high pressure molding or foaming molding.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: August 5, 2003
    Assignee: Vantico, Inc.
    Inventors: Didier Arnoux, Roman Gattlen, Peter Hochwald