Patents by Inventor Didier Cottet
Didier Cottet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240030101Abstract: A power module includes a power semiconductor module having a semiconductor chip arranged on a substrate. A lead frame is arranged in electrical contact with the semiconductor chip. Abase plate includes cooling structures and micro channels that are connected to an inlet port and an outlet port. A bond layer connects the power semiconductor module and the base plate. A mold compound is arranged on the power semiconductor module, the bond layer and the base plate. The bond layer is encapsulated completely by the power semiconductor module, the base plate and the mold compound and the lead frame is arranged at least partially within the mold compound.Type: ApplicationFiled: September 16, 2021Publication date: January 25, 2024Inventors: Niko Pavlicek, Didier Cottet, Thomas Gradinger, Chunlei Liu, Fabian Mohn, Giovanni Salvatore, Juergen Schuderer, Daniele Torresin, Felix Traub
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Patent number: 11742312Abstract: A power semiconductor module comprises abase plate (1); a semiconductor chip (2) disposed on and in contact with a top surface of the base plate (1), a preform (3) disposed on and in contact with a top surface of the semiconductor chip (2); and a pressing element (4) in contact with and applying a pressure onto a top surface of the preform (3). The preform (3) comprises a first electrically conductive layer (6) and a second electrically conductive layer (5). The first electrically conductive layer (6) has at least one protrusion (7) protruding towards the top surface of the semiconductor chip (2) and defining a recess (9) in the first electrically conductive layer (6) of the preform (3), wherein the recess (9) may annularly surround the protrusion (7). The at least one protrusion (7) is made from the same material as the first electrically conducting layer (6) and integrally formed with it or the first electrically conducting layer (6) and the at least one protrusion (7) are made from different materials.Type: GrantFiled: October 17, 2019Date of Patent: August 29, 2023Assignee: Hitachi Energy Switzerland AGInventors: Didier Cottet, Slavo Kicin
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Patent number: 11695331Abstract: A converter apparatus includes a string of electrically interconnected modules that includes a first group of modules comprising a first module and a second group of modules comprising a second module. A first screen is connected to a first defined electric potential and is located adjacent the first group of modules and a second screen is connected to a second defined electric potential and is located adjacent the second group of modules. During operation of the converter apparatus a resonance loop is created from the first module via the first and second screens and the second module back to the first module. A damping unit is located in the resonance loop and is set to dampen electromagnetic noise.Type: GrantFiled: August 5, 2019Date of Patent: July 4, 2023Assignee: Hitachi Energy Switzerland AGInventors: Arne Schroeder, Didier Cottet, Wojciech Piasecki, Filip Grecki, Bernhard Wunsch, Torsten Nilsson
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Publication number: 20220337154Abstract: A converter apparatus includes a string of electrically interconnected modules that includes a first group of modules comprising a first module and a second group of modules comprising a second module. A first screen is connected to a first defined electric potential and is located adjacent the first group of modules and a second screen is connected to a second defined electric potential and is located adjacent the second group of modules. During operation of the converter apparatus a resonance loop is created from the first module via the first and second screens and the second module back to the first module. A damping unit is located in the resonance loop and is set to dampen electromagnetic noise.Type: ApplicationFiled: August 5, 2019Publication date: October 20, 2022Inventors: Arne Schroeder, Didier Cottet, Wojciech Piasecki, Filip Grecki, Bernhard Wunsch, Torsten Nilsson
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Publication number: 20220028822Abstract: A power semiconductor module comprises a base plate (1); a semiconductor chip (2) disposed on and in contact with a top surface of the base plate (1), a preform (3) disposed on and in contact with a top surface of the semiconductor chip (2); and a pressing element (4) in contact with and applying a pressure onto a top surface of the preform (3). The preform (3) comprises a first electrically conductive layer (6) and a second electrically conductive layer (5). The first electrically conductive layer (6) has at least one protrusion (7) protruding towards the top surface of the semiconductor chip (2) and defining a recess (9) in the first electrically conductive layer (6) of the preform (3), wherein the recess (9) may annularly surround the protrusion (7). The at least one protrusion (7) is made from the same material as the first electrically conducting layer (6) and integrally formed with it or the first electrically conducting layer (6) and the at least one protrusion (7) are made from different materials.Type: ApplicationFiled: October 17, 2019Publication date: January 27, 2022Inventors: Didier Cottet, Slavo Kicin
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Patent number: 11018109Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.Type: GrantFiled: June 17, 2019Date of Patent: May 25, 2021Assignees: ABB Power Grids Switzerland AG, Audi AGInventors: Didier Cottet, Felix Traub, Jürgen Schuderer, Andreas Apelsmeier, Johann Asam
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Publication number: 20190304946Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.Type: ApplicationFiled: June 17, 2019Publication date: October 3, 2019Inventors: Didier Cottet, Felix Traub, Jürgen Schuderer, Andreas Apelsmeier, Johann Asam
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Patent number: 10283436Abstract: A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the firType: GrantFiled: October 13, 2017Date of Patent: May 7, 2019Assignee: ABB Schweiz AGInventors: Juergen Schuderer, Fabian Mohn, Didier Cottet, Felix Traub, Daniel Kearney
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Patent number: 10224424Abstract: A semiconductor module comprises a semiconductor chip comprising a semiconductor switch having a collector, emitter and gate, a collector terminal connected to the collector, gate terminal connected to the gate, an emitter terminal connected to the emitter via an emitter conductor path having an emitter inductance, an auxiliary emitter terminal connected to the emitter, a first conductor path connected to the emitter, and a second conductor path connected to the emitter having a different mutually inductive coupling with the emitter conductor path as the first conductor path. The first conductor path and the second conductor path are connectable to the auxiliary emitter terminal and/or the first conductor path is connected to the auxiliary emitter terminal and the second conductor path is connected to a second auxiliary emitter terminal.Type: GrantFiled: August 15, 2016Date of Patent: March 5, 2019Assignee: ABB Schweiz AGInventors: Samuel Hartmann, Didier Cottet, Slavo Kicin
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Patent number: 10056943Abstract: The present application is concerned with a system for transmitting and/or receiving the control and sensing signals between the control units and the power electronic components. One system according to the present application comprises: a transceiver adapted to modulate the communication signal on a communication signal frequency band, and a coupler connected to the power conductor and adapted to couple the modulated communication signal to the power conductor. The present application also concerns a method for transmitting and receiving the control and sensing signals.Type: GrantFiled: March 23, 2016Date of Patent: August 21, 2018Assignee: ABB Research Ltd.Inventors: Dacfey Dzung, Didier Cottet, Simon Douglas Round
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Patent number: 9899283Abstract: A power module providing a half bridge comprises at least one substrate and an inner metallization area, two intermediate metallization areas and two outer metallization areas, each of which extends in a longitudinal direction of the at least one substrate; wherein the two intermediate metallization areas are arranged besides the inner metallization area with respect to a cross direction of the at least one substrate and each outer metallization area is arranged beside one of the two intermediate metallization areas with respect to the cross direction; wherein the power module comprises two inner sets of semiconductor switches, each inner set of semiconductor switches bonded to an intermediate metallization area and electrically connected to the inner metallization area, such that the inner sets of semiconductor switches form a first arm of the half bridge; wherein the power module comprises two outer sets of semiconductor switches, each outer set of semiconductor switches bonded to an outer metallization areType: GrantFiled: May 19, 2017Date of Patent: February 20, 2018Assignee: ABB Schweiz AGInventors: Didier Cottet, Felix Traub
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Publication number: 20180040538Abstract: A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the firType: ApplicationFiled: October 13, 2017Publication date: February 8, 2018Inventors: Juergen Schuderer, Fabian Mohn, Didier Cottet, Felix Traub, Daniel Kearney
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Publication number: 20170338162Abstract: A power module providing a half bridge comprises at least one substrate and an inner metallization area, two intermediate metallization areas and two outer metallization areas, each of which extends in a longitudinal direction of the at least one substrate; wherein the two intermediate metallization areas are arranged besides the inner metallization area with respect to a cross direction of the at least one substrate and each outer metallization area is arranged beside one of the two intermediate metallization areas with respect to the cross direction; wherein the power module comprises two inner sets of semiconductor switches, each inner set of semiconductor switches bonded to an intermediate metallization area and electrically connected to the inner metallization area, such that the inner sets of semiconductor switches form a first arm of the half bridge; wherein the power module comprises two outer sets of semiconductor switches, each outer set of semiconductor switches bonded to an outer metallization areType: ApplicationFiled: May 19, 2017Publication date: November 23, 2017Inventors: Didier Cottet, Felix Traub
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Patent number: 9607924Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.Type: GrantFiled: August 12, 2015Date of Patent: March 28, 2017Assignee: ABB Technology OYInventors: Daniel Kearney, Francesco Agostini, Didier Cottet, Daniele Torresin, Mathieu Habert
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Publication number: 20160351697Abstract: A semiconductor module comprises a semiconductor chip comprising a semiconductor switch having a collector, emitter and gate, a collector terminal connected to the collector, gate terminal connected to the gate, an emitter terminal connected to the emitter via an emitter conductor path having an emitter inductance, an auxiliary emitter terminal connected to the emitter, a first conductor path connected to the emitter, and a second conductor path connected to the emitter having a different mutually inductive coupling with the emitter conductor path as the first conductor path. The first conductor path and the second conductor path are connectable to the auxiliary emitter terminal and/or the first conductor path is connected to the auxiliary emitter terminal and the second conductor path is connected to a second auxiliary emitter terminal.Type: ApplicationFiled: August 15, 2016Publication date: December 1, 2016Inventors: Samuel Hartmann, Didier Cottet, Slavo Kicin
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Publication number: 20160277071Abstract: The present invention is concerned with a system for transmitting and/or receiving the control and sensing signals between the control units and the power electronic components. The system according to the present invention comprises: a transceiver adapted to modulate the communication signal on a communication signal frequency band, and a coupler connected to the power conductor and adapted to couple the modulated communication signal to the power conductor. The present invention also concerns a method for transmitting and receiving the control and sensing signals.Type: ApplicationFiled: March 23, 2016Publication date: September 22, 2016Inventors: Dacfey Dzung, Didier Cottet, Simon Douglas Round
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Publication number: 20160079156Abstract: The present disclosure describes a power electronics module comprising a lead frame in which a chip of a first semiconductor device is embedded, a first PCB mounted on top of the lead frame and the chip of the first semiconductor device, and a support frame mounted on top of the PCB, the support frame comprising a cavity in which the chip of a second semiconductor device is embedded, wherein the chips of the first semiconductor device and the second semiconductor device are positioned on top of each other, and the first PCB comprises a first electrically conducting path between the chips of the first semiconductor device and the second semiconductor device.Type: ApplicationFiled: August 17, 2015Publication date: March 17, 2016Inventors: Chunlei Liu, Didier Cottet, Franziska Brem, Slavo Kicin
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Publication number: 20160049354Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.Type: ApplicationFiled: August 12, 2015Publication date: February 18, 2016Inventors: Daniel Kearney, Francesco Agostini, Didier Cottet, Daniele Torresin, Mathieu Habert
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Patent number: 9113578Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.Type: GrantFiled: October 31, 2012Date of Patent: August 18, 2015Assignee: ABB TECHNOLOGY AGInventors: Didier Cottet, Francesco Agostini, Thomas Gradinger, Andreas Vögeli
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Patent number: 9113579Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.Type: GrantFiled: October 31, 2012Date of Patent: August 18, 2015Assignee: ABB TECHNOLOGY AGInventors: Didier Cottet, Francesco Agostini, Thomas Gradinger, Andreas Vögeli