Abstract: The invention relates to a method for manufacturing a radio-frequency identification tag comprising a textile material backing intended to receive a radio-frequency identification module coupled with an electrical antenna. The method comprises the following steps: a) depositing (E1) a thermosetting adhesive on an area of the textile backing, b) depositing (E2) said electrical antenna (12) on the adhesive layer; c) depositing (E3) said radio-frequency identification module on the antenna and the adhesive layer, the radio-frequency identification module being positioned so as to be coupled with the antenna and at least partially in contact with the adhesive layer; d) folding (E4) the textile backing so as to cover said antenna and said radio-frequency identification module; and e) hot-pressing (E5) the folded textile backing so as to embed at least partially the antenna and the radio-frequency identification module in the adhesive layer and polymerise at least partially said adhesive layer.

Abstract: A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna structure, a heat activated second adhesive layer and a pressure sensitive adhesive (PSA) layer for holding the RFID tag. The process further includes positioning the RFID tag on the PSA layer, pressing the tag against the PSA layer such that the PSA layer holds the tag against the heat fusible label at least temporarily, positioning the heat fusible label with the RFID tag on the flexible surface and applying heat and pressure to the heat fusible label to melt the heat activated layer and to fuse the label to the flexible surface.

Abstract: The invention relates to a method for manufacturing a radio-frequency identification tag comprising a textile material backing intended to receive a radio-frequency identification module coupled with an electrical antenna. The method comprises the following steps: a) depositing (E1) a thermosetting adhesive on an area of the textile backing, b) depositing (E2) said electrical antenna (12) on the adhesive layer; c) depositing (E3) said radio-frequency identification module on the antenna and the adhesive layer, the radio-frequency identification module being positioned so as to be coupled with the antenna and at least partially in contact with the adhesive layer; d) folding (E4) the textile backing so as to cover said antenna and said radio-frequency identification module; and e) hot-pressing (E5) the folded textile backing so as to embed at least partially the antenna and the radio-frequency identification module in the adhesive layer and polymerise at least partially said adhesive layer.

Abstract: A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna structure, a heat activated second adhesive layer and a pressure sensitive adhesive (PSA) layer for holding the RFID tag. The process further includes positioning the RFID tag on the PSA layer, pressing the tag against the PSA layer such that the PSA layer holds the tag against the heat fusible label at least temporarily, positioning the heat fusible label with the RFID tag on the flexible surface and applying heat and pressure to the heat fusible label to melt the heat activated layer and to fuse the label to the flexible surface.

Abstract: A tag assembly is disclosed for attaching an RFID tag including a primary antenna to a flexible surface such as fabric, textile or an item of clothing. The tag assembly has a receptacle including a frame for securely holding the RFID tag, a secondary antenna, and attachment means for attaching the frame to the surface, wherein the frame forms part of the secondary antenna. A method of attaching an RFID tag to a flexible surface is also disclosed.

Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.

Abstract: A dongle is formed by a module having an integrated circuit chip which is connected to contact pads which are flush with the surface of the module. The dongle is intended to be connected to a port of a telecommunications device, having electric connecting pins. The contact pads correspond to the electric connecting pins in such a way that the pads can be directly connected to the pins.

Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.

Abstract: An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Abstract: An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Abstract: A dongle is formed by a module having an integrated circuit chip which is connected to contact pads which are flush with the surface of the module. The dongle is intended to be connected to a port of a telecommunications device, having electric connecting pins. The contact pads correspond to the electric connecting pins in such a way that the pads can be directly connected to the pins.

Abstract: An electronic module or label which is adapted to be rendered adhesive including a support film having an insulative film and at a communication interface disposed on the insulative film, at least one microcircuit, the communication interface being connected to the microcircuit by connections, an adhesive tape including an activatable adhesive adhered to the insulative film and a perforation coinciding with a predetermined area of the support film that includes the microcircuit and connections, a coating resin protecting the microcircuit and the connections and covering the predetermined area within the perforation. The adhesive tape can also include a removable protective film. After removing the removable protective film, the module or label can be adhered to a card body, forming a electronic card such as a smart card. In other embodiments, adhesive is applied to the support film so as to form a delimitation in which the coating resin is applied.

Abstract: The present invention relates to a method of fabricating at least one electronic module or label which is adapted to be rendered adhesive. The method includes the following steps: an insulative film is supplied including at least one contact and/or antenna type interface, and an adhesive tape is supplied including an activatable adhesive and a removable protective film. The tape includes at least one perforation corresponding to the area of the resin on the module or label. The adhesive tape is applied to the support film so that the perforation coincides with the area of the resin and the adhesive is activated so that it fixes the tape to the film. The coating resin is dispensed over the intended area at least within the perforation and in contact with the perforation. The invention also provides a method in which the activatable adhesive is deposited with no protection film.

Abstract: The invention concerns a method for protecting integrated circuit chips of a silicon wafer. The silicon wafer is cut so as to disengage the chips from the integrated circuit; and a fluid insulating material is applied on the rear surface of the wafer so as to coat the flanks of each chip of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips where the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.

Abstract: The invention relates to a chip card (10) including an electronic module, which module is fitted with an interface for electrical and/or electromagnetic communications formed by electrical contacts (12) and/or an antenna (22). It is characterised in that it includes at least one guarantee label (14) which is bonded to one of its surfaces and which can be unbonded by breaking the adhesion, said label being suitable for preventing said interface (12, 22) from communicating with the outside world.