Patents by Inventor Didier Goy

Didier Goy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150218811
    Abstract: The multi-ply panel for forming or adding to a wall, floor, or ceiling, or for the inclined surface of a building includes a stack of layers. At least one layer is formed of parallel structural strips, preferably made of wood. Filler strips are placed between the structural strips and made of a different material than that of the structural strips. The materials may be selected for the heat or sound insulation properties, thermal inertia, or fire-resistant properties thereof. At least one rigid filler strip is made of an insulating material with heat conductivity less than 0.038 W/m·K.
    Type: Application
    Filed: April 11, 2012
    Publication date: August 6, 2015
    Applicant: TECHNIWOOD INTERNATIONAL
    Inventors: Laurent Bourdon, Pascal Faure, Didier Goy, Christian Chabrier