Patents by Inventor Didier Weber

Didier Weber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240049415
    Abstract: The invention relates to a control device having a casing, control electronics located in the casing, and at least one electrical feedthrough. By means of the electrical feedthrough, current can be provided for a load which is located outside the casing of the control device. The electrical feedthrough is located on the casing. The casing is fluid-tight at least in part, and the electrical feedthrough is located in a fluid-tight region of the casing. The electrical feedthrough has a metal core and an insulator surrounding the metal core. The metal core has an end face. A first bond is provided between the end face of the metal core and the control electronics, the first bond being laser-bonded at the end face.
    Type: Application
    Filed: December 9, 2021
    Publication date: February 8, 2024
    Inventors: Jens Maerkle, Didier Weber, Manfred Burkart, Steffan Meier
  • Patent number: 6128189
    Abstract: A device for dissipation of the thermal power loss of an electronic or electromechanical component (10) is proposed, in which an adequate cooling surface area is available. To obtain the largest possible cooling surface area at low assembly outlay, the components (1) have a heat-conducting connection with a metal-coated surface of a printed circuit board (2). The coated surface parts (5, 7) protrude as far as a connecting segment (10; 10a, 10b, 10c) of a housing (8, 9) that entirely or partially surrounds the printed circuit board (2). At least one connecting segment (10, 10a, 10b, 10c) of the housing (8, 9) is embodied in crowned fashion on its surface such, that upon fastening of the housing (8, 9) to the printed circuit board (2), a durable contact pressure between the housing (8, 9) and the printed circuit board (2) is exerted by the deformation of the crowned surface.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: October 3, 2000
    Assignee: Robert Bosch GmbH
    Inventors: Dieter Hussmann, Peter Jares, Thomas Jessberger, Didier Weber