Patents by Inventor Die-Chi Sun

Die-Chi Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
    Publication number: 20060192221
    Abstract: Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.
    Type: Application
    Filed: April 24, 2006
    Publication date: August 31, 2006
    Inventors: Michael Zhou, Die-Chi Sun, Kee-Sin Tan, Wenbin Jiang
  • Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
    Patent number: 7061949
    Abstract: Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: June 13, 2006
    Assignee: JDS Uniphase Corporation
    Inventors: Michael Zhou, Die-Chi Sun, Kee-Sin Tan, Wenbin Jiang