Patents by Inventor Diederik Vermeulen

Diederik Vermeulen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9810846
    Abstract: Disclosed are optical devices for coupling radiation between an optical waveguide and an external medium. In one embodiment, an optical device is disclosed comprising a semiconductor die comprising an integrated optical waveguide core and an overlying optical waveguide comprising a waveguide taper and a waveguide facet. The overlying optical waveguide at least partially overlies the integrated optical waveguide core, and the waveguide facet is between about 1 ?m and 200 ?m from an edge of the semiconductor die. In another embodiment, a method is disclosed comprising providing a substrate comprising an integrated semiconductor waveguide and forming on the substrate an overlying waveguide comprising a waveguide taper and a waveguide facet. The overlying waveguide at least partially overlies the integrated semiconductor waveguide. The method further includes cutting the substrate about 1 ?m and 200 ?m from the waveguide facet.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: November 7, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Dirk Taillaert, Diederik Vermeulen, Jonathan Schrauwen, Gunther Roelkens
  • Publication number: 20120093456
    Abstract: Disclosed are optical devices for coupling radiation between an optical waveguide and an external medium. In one embodiment, an optical device is disclosed comprising a semiconductor die comprising an integrated optical waveguide core and an overlying optical waveguide comprising a waveguide taper and a waveguide facet. The overlying optical waveguide at least partially overlies the integrated optical waveguide core, and the waveguide facet is between about 1 ?m and 200 ?m from an edge of the semiconductor die. In another embodiment, a method is disclosed comprising providing a substrate comprising an integrated semiconductor waveguide and forming on the substrate an overlying waveguide comprising a waveguide taper and a waveguide facet. The overlying waveguide at least partially overlies the integrated semiconductor waveguide. The method further includes cutting the substrate about 1 ?m and 200 ?m from the waveguide facet.
    Type: Application
    Filed: October 14, 2011
    Publication date: April 19, 2012
    Applicants: Universiteit Gent, IMEC
    Inventors: Dirk Taillaert, Diederik Vermeulen, Jonathan Schrauwen, Gunther Roelkens