Patents by Inventor Diedrik Vermeulen

Diedrik Vermeulen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Co-packaging photonic integrated circuits and application specific integrated circuits
    Patent number: 10578799
    Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 3, 2020
    Assignee: Acaia Communications
    Inventors: Christopher Doerr, Eric Swanson, Diedrik Vermeulen, Saeid Azemati, Jon Stahl
  • Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters
    Patent number: 10535571
    Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: January 14, 2020
    Assignee: Acacia Communications, Inc.
    Inventors: Diedrik Vermeulen, Long Chen, Christopher Doerr
  • Advanced optical modulation generation by combining orthogonal polarized optical signals via laser with dual output ports
    Patent number: 10394058
    Abstract: Optical modulators and modulation techniques for advanced optical modulation formats are described. An optical modulator may include two optical modulators in parallel optical paths, and optical powers in the two paths may be unequal. Polarization in the two paths may be orthogonal, and modulated outputs from each path may be combined to produce multilevel modulation formats.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: August 27, 2019
    Assignee: Acacia Communications, Inc.
    Inventors: Diedrik Vermeulen, Christopher Doerr
  • SYSTEMS, METHODS, AND STRUCTURES FOR OPTICAL PHASED ARRAY CALIBRATION VIA INTERFERENCE
    Publication number: 20190260123
    Abstract: Aspects of the present disclosure describe systems, methods, and structures for optical phased array calibration that advantageously may be performed as a single-pass measurement of phase offset with respect to only a single interference measurement. In sharp contrast to the prior art—systems, methods, and structures according to aspects of the present disclosure advantageously produce phase offsets and phase functions of each element without time-consuming iterative procedures or multiple detector signals as required by the prior art.
    Type: Application
    Filed: February 19, 2019
    Publication date: August 22, 2019
    Applicant: ANALOG PHOTONICS LLC
    Inventors: Christopher Nicholas POULTON, Peter RUSSO, Erman TIMURDOGAN, Matthew BYRD, Diedrik VERMEULEN, Ehsan HOSSEINI
  • ABERRATION CORRECTION OF OPTICAL PHASED ARRAYS
    Publication number: 20190235233
    Abstract: Aspects of the present disclosure describe systems, methods, and structures for aberration correction of optical phased arrays that employ a corrective optical path difference (OPD) in the near-field of an OPA to correct or cancel out aberrations in emitted beams of the OPA including those reaching far-field distances by generating a spatially-varying OPD across the aperture of the OPA that is substantially equal and opposite to an equivalent OPD of the aberration(s).
    Type: Application
    Filed: January 28, 2019
    Publication date: August 1, 2019
    Applicant: ANALOG PHOTONICS LLC
    Inventors: Peter Nicholas RUSSO, Ehsan HOSSEINI, Christopher POULTON, Erman TIMURDOGAN, Diedrik VERMEULEN, Michael Robert WATTS, Michael WHITSON
  • Cladding defined transmission grating
    Patent number: 10168476
    Abstract: Disclosed herein are techniques, methods, structures and apparatus for providing photonic structures and integrated circuits with optical gratings disposed within cladding layer(s) of those structures and circuits.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: January 1, 2019
    Assignee: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Diedrik Vermeulen
  • INTEGRATED OPTICAL STRUCTURES FOR LiDAR AND OTHER APPLICATIONS EMPLOYING MULTIPLE DETECTORS
    Publication number: 20180364336
    Abstract: Aspects of the present disclosure describe systems, methods, and structures—including LiDAR—that employ multiple detectors that may determine multiple incident angles of multiple received radiation beams and advantageously do not require or employ phase shifters in illustrative embodiments and may instead—employ optical Fourier transform structures.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 20, 2018
    Applicant: ANALOG PHOTONICS LLC
    Inventors: Ehsan HOSSEINI, Michael WATTS, Christopher POULTON, Matthew BYRD, Diedrik VERMEULEN, Peter RUSSO
  • ON-CHIP OPTICAL GAIN CIRCUITS
    Publication number: 20180351317
    Abstract: Aspects of the present disclosure describe photonic circuits that include an amplifier section or multiple amplifier sections to boost the output power of an optical transmitter and includes additional components including—but not limited to—a band pass optical filter, a wavelength demultiplexer and additional components—all on a single chip.
    Type: Application
    Filed: April 27, 2018
    Publication date: December 6, 2018
    Applicant: ANALOG PHOTONICS LLC
    Inventor: Diedrik VERMEULEN
  • WAVELENGTH DIVISION MULTIPLEXED LIDAR
    Publication number: 20180306925
    Abstract: Aspects of the present disclosure describe wavelength division multiplexed LiDAR systems, methods, and structures that advantageously provide a wide field of view without employing lasers having a large tuning range.
    Type: Application
    Filed: April 25, 2018
    Publication date: October 25, 2018
    Applicant: ANALOG PHOTONICS LLC
    Inventors: Ehsan HOSSEINI, Michael WATTS, Christopher POULTON, Diedrik VERMEULEN
  • Advanced optical modulation generation by combining orthogonal polarized optical signals
    Patent number: 10078232
    Abstract: Optical modulators and modulation techniques for advanced optical modulation formats are described. An optical modulator may include two optical modulators in parallel optical paths, and optical powers in the two paths may be unequal. Polarization in the two paths may be orthogonal, and modulated outputs from each path may be combined to produce multilevel modulation formats.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: September 18, 2018
    Assignee: Acacia Communications, Inc.
    Inventors: Diedrik Vermeulen, Christopher Doerr
  • CO-PACKAGING PHOTONIC INTEGRATED CIRCUITS AND APPLICATION SPECIFIC INTEGRATED CIRCUITS
    Publication number: 20180203187
    Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 19, 2018
    Applicant: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Eric Swanson, Diedrik Vermeulen, Saeid Azemati, Jon Stahl
  • Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters
    Patent number: 9922887
    Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: March 20, 2018
    Assignee: Acacia Communications, Inc.
    Inventors: Diedrik Vermeulen, Long Chen, Christopher Doerr
  • Co-packaging photonic integrated circuits and application specific integrated circuits
    Patent number: 9874688
    Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: January 23, 2018
    Assignee: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Eric Swanson, Diedrik Vermeulen, Saeid Azemati, Jon Stahl
  • Through transmission path on photonic circuits for optical alignment
    Patent number: 9829659
    Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: November 28, 2017
    Assignee: Acacia Communications, Inc.
    Inventors: Long Chen, Christopher Doerr, Diedrik Vermeulen
  • Low-loss waveguide transition
    Patent number: 9664853
    Abstract: A waveguide device that includes a first waveguide, a second waveguide and a transition region. The first waveguide has a first height and the second waveguide has a second height different from the first height. The transition region is between the first waveguide and the second waveguide and includes an asymmetrical taper of the first waveguide.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: May 30, 2017
    Assignee: Acacia Communications, Inc.
    Inventor: Diedrik Vermeulen
  • CLADDING DEFINED TRANSMISSION GRATING
    Publication number: 20170123154
    Abstract: Disclosed herein are techniques, methods, structures and apparatus for providing photonic structures and integrated circuits with optical gratings disposed within cladding layer(s) of those structures and circuits.
    Type: Application
    Filed: November 22, 2016
    Publication date: May 4, 2017
    Applicant: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Diedrik Vermeulen
  • Advanced optical modulation generation by combining orthogonal polarized optical signals
    Patent number: 9628186
    Abstract: Disclosed are adaptive structures and methods for generating advanced modulation formats using multiple levels such as PAM-4, PAM-8 as well as regular OOK or PM OOK formats. Structures and methods disclosed include an unequal power splitter that may exhibit a fixed or tunable splitting ratio such that adaptive format(s) may be generated.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: April 18, 2017
    Assignee: Acacia Communications, Inc.
    Inventor: Diedrik Vermeulen
  • TANDEM-PHASE-MODULATOR-BASED OPTICAL ISOLATOR IN SILICON
    Publication number: 20170059958
    Abstract: Disclosed are structures and methods for optical isolation based on tandem phase modulators in a long interferometer that advantageously provides low-loss, broadband isolation in a photonic integrated circuit without requiring special materials or fabrication steps.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 2, 2017
    Inventors: Christopher DOERR, Long CHEN, Diedrik VERMEULEN
  • THROUGH TRANSMISSION PATH ON PHOTONIC CIRCUITS FOR OPTICAL ALIGNMENT
    Publication number: 20170031113
    Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.
    Type: Application
    Filed: October 17, 2016
    Publication date: February 2, 2017
    Applicant: Acacia Communications, Inc.
    Inventors: Long Chen, Christopher Doerr, Diedrik Vermeulen
  • Electronic and optical co-packaging of coherent transceiver
    Patent number: 9557478
    Abstract: Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: January 31, 2017
    Assignee: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Eric Swanson, Jon Stahl, Diedrik Vermeulen