Patents by Inventor Diego Emilio Serrano
Diego Emilio Serrano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240077312Abstract: Systems and methods disclosed herein include a device with a bulk acoustic wave resonator and one or more trenches that are configured to impede the flow of acoustic energy to the bulk acoustic wave resonator.Type: ApplicationFiled: September 7, 2022Publication date: March 7, 2024Inventors: Diego EMILIO SERRANO, Sagnik PAL, Amir RAHAFROOZ, Thomas Kieran NUNAN, Ijaz JAFRI
-
Patent number: 11725941Abstract: A sensing device includes a resonant member that is movable in a first mode and a second mode, and an electrode. The resonant member has a capacitive surface portion that faces and is capacitively coupled to a capacitive surface portion of the electrode. Displacement for each point along the capacitive surface portion of the resonant member in the first mode is substantially tangent to the point.Type: GrantFiled: December 27, 2019Date of Patent: August 15, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Amir Rahafrooz, Diego Emilio Serrano, Ijaz Hussain Jafri
-
Patent number: 11614328Abstract: A sensing device includes an anchor having a central axis that defines a first radial direction and a second radial direction, and a resonant member flexibly supported by the anchor that includes a main body made of a single-crystal solid. The main body has a first material stiffness in the first radial direction and a second material stiffness in the second radial direction that is less than the first material stiffness. Moreover, the main body has a first component stiffness in the first radial direction and a second component stiffness in the second radial direction that is substantially similar to the first component stiffness. Another sensing device includes a resonant member having a main body that defines an aperture extending through the main body, and an electrode located in the aperture such that a capacitive channel is defined between the electrode and the main body that circumscribes the electrode.Type: GrantFiled: December 27, 2019Date of Patent: March 28, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Sagnik Pal, Diego Emilio Serrano, Thomas Kieran Nunan
-
Publication number: 20220349712Abstract: A sensing device includes an anchor having a central axis that defines a first radial direction and a second radial direction, and a resonant member flexibly supported by the anchor that includes a main body made of a single-crystal solid. The main body has a first material stiffness in the first radial direction and a second material stiffness in the second radial direction that is less than the first material stiffness. Moreover, the main body has a first component stiffness in the first radial direction and a second component stiffness in the second radial direction that is substantially similar to the first component stiffness. Another sensing device includes a resonant member having a main body that defines an aperture extending through the main body, and an electrode located in the aperture such that a capacitive channel is defined between the electrode and the main body that circumscribes the electrode.Type: ApplicationFiled: December 27, 2019Publication date: November 3, 2022Inventors: Sagnik PAL, Diego Emilio SERRANO, Thomas Kieran NUNAN
-
Publication number: 20220316881Abstract: A sensing device includes a resonant member that is movable in a first mode and a second mode, and an electrode. The resonant member has a capacitive surface portion that faces and is capacitively coupled to a capacitive surface portion of the electrode. Displacement for each point along the capacitive surface portion of the resonant member in the first mode is substantially tangent to the point.Type: ApplicationFiled: December 27, 2019Publication date: October 6, 2022Inventors: Amir RAHAFROOZ, Diego Emilio SERRANO, Ijaz Hussain JAFRI
-
Patent number: 11358858Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor layer having a first-type region and a second-type region that are stacked and interface with each other to form a p-n junction, the first-type region defining a first side of the semiconductor layer and the second-type region defining a second side of the semiconductor layer. The method further includes providing an insulating layer on the second side of the semiconductor layer and etching the semiconductor layer from the first side of the semiconductor layer toward the second side of the semiconductor layer to form a trench. The first-type region corresponds to one of a n-type region and a p-type region, and the second-type region corresponds to the other of the n-type region and the p-type region.Type: GrantFiled: January 24, 2020Date of Patent: June 14, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Amir Rahafrooz, Thomas Kieran Nunan, Diego Emilio Serrano, Ijaz Jafri
-
Publication number: 20220128359Abstract: A sensing device includes an anchor having a central axis that defines a first radial direction and a second radial direction, and a resonant member flexibly supported by the anchor that includes a main body made of a single-crystal solid. The main body has a first material stiffness in the first radial direction and a second material stiffness in the second radial direction that is less than the first material stiffness. Moreover, the main body has a first component stiffness in the first radial direction and a second component stiffness in the second radial direction that is substantially similar to the first component stiffness. Another sensing device includes a resonant member having a main body that defines an aperture extending through the main body, and an electrode located in the aperture such that a capacitive channel is defined between the electrode and the main body that circumscribes the electrode.Type: ApplicationFiled: December 27, 2019Publication date: April 28, 2022Inventors: Sagnik PAL, Diego Emilio SERRANO, Thomas Kieran NUNAN
-
Publication number: 20220107181Abstract: A sensing device includes a resonant member that is movable in a first mode and a second mode, and an electrode. The resonant member has a capacitive surface portion that faces and is capacitively coupled to a capacitive surface portion of the electrode. Displacement for each point along the capacitive surface portion of the resonant member in the first mode is substantially tangent to the point.Type: ApplicationFiled: December 27, 2019Publication date: April 7, 2022Inventors: Amir RAHAFROOZ, Diego Emilio SERRANO, Ijaz Hussain JAFRI
-
Patent number: 11125579Abstract: An aspect of the present disclosure concerns a calibration system including a test tone signal generator that produces a test tone; a transimpedance amplifier (TIA) that comprises two input terminals, receives two output signals from an external sensor device, the test tone, and a calibration signal at the two input terminals, and produces a voltage signal; and a calibration circuit that receives the voltage signal and the test tone to produce the calibration signal that causes the TIA to produce the voltage signal such that an error signal included in the voltage signal is canceled. The external sensor device may be a mode-matched vibratory micro-electro-mechanical systems (MEMS) gyroscope.Type: GrantFiled: March 29, 2019Date of Patent: September 21, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Ronald Joseph Lipka, Diego Emilio Serrano
-
Publication number: 20210229978Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor layer having a first-type region and a second-type region that are stacked and interface with each other to form a p-n junction, the first-type region defining a first side of the semiconductor layer and the second-type region defining a second side of the semiconductor layer. The method further includes providing an insulating layer on the second side of the semiconductor layer and etching the semiconductor layer from the first side of the semiconductor layer toward the second side of the semiconductor layer to form a trench. The first-type region corresponds to one of a n-type region and a p-type region, and the second-type region corresponds to the other of the n-type region and the p-type region.Type: ApplicationFiled: January 24, 2020Publication date: July 29, 2021Inventors: Amir RAHAFROOZ, Thomas Kieran NUNAN, Diego EMILIO SERRANO, Ijaz JAFRI
-
Publication number: 20200309563Abstract: An aspect of the present disclosure concerns a calibration system including a test tone signal generator that produces a test tone; a transimpedance amplifier (TIA) that comprises two input terminals, receives two output signals from an external sensor device, the test tone, and a calibration signal at the two input terminals, and produces a voltage signal; and a calibration circuit that receives the voltage signal and the test tone to produce the calibration signal that causes the TIA to produce the voltage signal such that an error signal included in the voltage signal is canceled. The external sensor device may be a mode-matched vibratory micro-electro-mechanical systems (MEMS) gyroscope.Type: ApplicationFiled: March 29, 2019Publication date: October 1, 2020Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Ronald Joseph Lipka, Diego Emilio Serrano
-
Patent number: 10082394Abstract: A MEMS BAW vibratory planar gyroscope having an in-plane electrode configuration for mode-alignment by utilizing alignment electrodes that have a height less than a full height of the gyroscope resonant body. Such alignment electrodes apply a force component that affects modes with both in-plane and out-of-plane movements. The gyroscope includes a resonant body having a height and a perimeter surface and electrodes disposed adjacent the exterior perimeter surface of the resonant body. At least one of the electrodes is an alignment electrode and has a height less than the height of the resonant body.Type: GrantFiled: May 31, 2016Date of Patent: September 25, 2018Assignee: PANASONIC CORPORATIONInventors: Amir Rahafrooz, Diego Emilio Serrano, Ijaz Jafri
-
Publication number: 20160349055Abstract: A MEMS BAW vibratory planar gyroscope having an in-plane electrode configuration for mode-alignment by utilizing alignment electrodes that have a height less than a full height of the gyroscope resonant body. Such alignment electrodes apply a force component that affects modes with both in-plane and out-of-plane movements. The gyroscope includes a resonant body having a height and a perimeter surface and electrodes disposed adjacent the exterior perimeter surface of the resonant body. At least one of the electrodes is an alignment electrode and has a height less than the height of the resonant body.Type: ApplicationFiled: May 31, 2016Publication date: December 1, 2016Applicant: Qualtre, Inc.Inventors: Amir Rahafrooz, Diego Emilio Serrano, Ijaz Jafri
-
Patent number: 8450913Abstract: A microelectromechanical resonator can include a suspended frame-shaped beam anchored at four corners thereof to a surrounding substrate along with a suspended resonator plate tethered on four sides thereof to corresponding sides of the frame-shaped beam. A pair of drive electrodes are provided on first and third diametrically opposite corners of the frame-shaped beam and a pair of sense electrodes are provided on second and fourth diametrically opposite corners of the frame-shaped beam. The resonator may also include a ground electrode on the frame-shaped beam and a piezoelectric layer sandwiched between each of the drive and sense electrodes and the ground electrode.Type: GrantFiled: March 31, 2011Date of Patent: May 28, 2013Assignee: Georgia Tech Research CorporationInventors: Farrokh Ayazi, Diego Emilio Serrano