Abstract: The application relates to a device for producing three-dimensional workpieces, the device including: a structural surface designed to receive a molding compound; and an irradiation arrangement designed to selectively irradiate the molding compound on the structural surface with electromagnetic radiation, in order to produce a workpiece by means of generative layer construction, where the irradiation device comprises a plurality of irradiation units, the irradiation units being designed to irradiate an individual region of the structural surface respectively associated with the irradiation units, and where the beams emitted by the irradiation units respectively have a cross-sectional surface corresponding to between approx. 2% and approx. 170% of the surface of the respectively associated individual region. The application also relates to the use of such a device and to a method for producing three-dimensional workpieces by means of such a device.

Abstract: In a method for producing a three-dimensional workpiece (12), a first raw material powder (50) is applied to a substrate (18) in order to produce a raw material powder layer consisting of the first raw material powder (50). The raw material powder layer consisting of the first raw material powder (50) is selectively irradiated with electromagnetic radiation or particle radiation in order to produce a solidified first workpiece layer portion (52) from the first raw material powder (50). Non-solidified first raw material powder (50) is then removed from the substrate (18).

Abstract: What is disclosed is a device (1) for automatic detection of a possible incorrect measurement, wherein the device (1) comprises at least one reflected light illumination apparatus (14) and/or a transmitted light illumination apparatus (6) and at least one imaging optical system (9) and one detector (11) of a camera (10) for imaging structures (3) on a substrate (2), wherein a first program portion (17) is linked to the detector (11) of the camera (10), said detector being provided for determining the position and/or dimension of the structure (3) on the substrate (2), wherein the device (1) determines and records a plurality of measurement variables Mj, j?{1, . . . , L}, from which at least one variable G can be determined, wherein a second program portion (18) is linked to the detector (11) of the camera (10), said program portion calculating an analysis of the measurement variables Mj with regard to a possible incorrect measurement.

Abstract: A coordinate measuring machine (1) for measuring structures (3) on a substrate (2) including a measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9), at least one laser interferometer (24) for determining the position of the measurement table (20) and the measurement objective (9) wherein the measurement table (20), the measurement objective (9) and the at least one laser interferometer (24) are arranged in a vacuum chamber (50).

Abstract: A system for determining positions of structures on a substrate is disclosed. The system includes a plurality of stations enclosed by a housing. At least one of the stations inside the housing is designed to be movable. The housing is provided with a filter fan unit generating an air flow in the housing. Air-directing elements are provided in the housing so that an invariable flow may be achieved irrespective of the at least one movable station.

Abstract: A device for measuring the position of at least one structure on a substrate is disclosed. The substrate to be measured is positioned in a mirror body. A flat insert is provided in the mirror body and is formed such that the substrate and the insert together always have the same optical thickness, irrespective of the mechanical thickness of the substrate.

Abstract: A method for correcting the measuring errors caused by the lens distortion of an objective in a coordinate measuring machine is disclosed. For a plurality of different types of structures, the lens distortion caused by an objective is determined in an image field of the objective. The position of a type of structure is determined in the image field of the objective by a measuring window. The correction of the lens distortion required for the type of structure to be measured is retrieved from the database as a function of the type of structure to be measured.

Abstract: The invention relates to an organic light emitting component, particularly an organic light emitting diode, in which an arrangement is formed that comprises a bottom electrode, a top electrode, and an organic layer region which is located between and is in electrical contact with the bottom electrode and the top electrode and contains at least one hole transport layer, at least one electron transport layer, and a light-emitting area. The bottom electrode is formed from a dispersion as a structured, binder-free, and optically transparent bottom electrode layer made of a bottom electrode material by means of a wet chemical application process, said bottom electrode material being an optically transparent, electrically conductive oxide. The bottom electrode layer has a sheet resistance of less than about 500 ?/square and an optical refractive index of less than 1.8.

Abstract: A method for determining the focal position of at least two edges of structures (31) on a substrate (30) is disclosed. During the movement of a measurement objective (21) in the Z-coordinate direction, a plurality of images of the at least one structure (31) is acquired with at least one measurement window (45) of a detector. An intensity profile of the structure (31) is determined for each image.

Abstract: A device for measuring the position of at least one structure on a substrate is disclosed. The substrate to be measured is positioned in a mirror body. A flat insert is provided in the mirror body and is formed such that the substrate and the insert together always have the same optical thickness, irrespective of the mechanical thickness of the substrate.

Abstract: An apparatus and a method are disclosed for supporting a substrate at a position with high precision. The substrate is placed on a stage which is configured to be traversable in a plane in two spatial directions oriented perpendicular to each other. The substrate is supported on three point-like support elements. At least one of the support elements is configured to be moveable in the plane.

Abstract: A system for determining positions of structures on a substrate is disclosed. The system includes a plurality of stations enclosed by a housing. At least one of the stations inside the housing is designed to be movable. The housing is provided with a filter fan unit generating an air flow in the housing. Air-directing elements are provided in the housing so that an invariable flow may be achieved irrespective of the at least one movable station.

Abstract: A method for correcting the measuring errors caused by the lens distortion of an objective in a coordinate measuring machine is disclosed. For a plurality of different types of structures, the lens distortion caused by an objective is determined in an image field of the objective. The position of a type of structure is determined in the image field of the objective by a measuring window. The correction of the lens distortion required for the type of structure to be measured is retrieved from the database as a function of the type of structure to be measured.

Abstract: A coordinate measuring machine (1) for measuring structures (3) on a substrate (2) including a measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9), at least one laser interferometer (24) for determining the position of the measurement table (20) and the measurement objective (9) wherein the measurement table (20), the measurement objective (9) and the at least one laser interferometer (24) are arranged in a vacuum chamber (50).

Abstract: A measuring apparatus for determining relative positions of a positioning stage arranged in a moveable fashion in at least one direction by a predeterminable maximum traversing path. The measuring device comprises at least one interferometric measuring means and at least one interferometric correction means. An interferometric measuring means is operable with the laser light of a laser of at least one wavelength. Correction results can be generated with the interferometric correction means allowing conclusions to be drawn with respect to the actual wavelength of the laser light during a position determination of the positioning stage in order to take into account variations of the wavelength of the laser light, in particular due to ambient conditions, when evaluating the measuring results. The interferometric correction means is arranged proximate to the interferometric measuring means, and the proximity corresponds to a predeterminable portion of the maximum traversing path of the positioning stage.

Abstract: A method for determining the focal position of at least two edges of structures (31) on a substrate (30) is disclosed. During the movement of a measurement objective (21) in the Z-coordinate direction, a plurality of images of the at least one structure (31) is acquired with at least one measurement window (45) of a detector. An intensity profile of the structure (31) is determined for each image.

Abstract: What is disclosed is a device (1) for automatic detection of a possible incorrect measurement, wherein the device (1) comprises at least one reflected light illumination apparatus (14) and/or a transmitted light illumination apparatus (6) and at least one imaging optical system (9) and one detector (11) of a camera (10) for imaging structures (3) on a substrate (2), wherein a first program portion (17) is linked to the detector (11) of the camera (10), said detector being provided for determining the position and/or dimension of the structure (3) on the substrate (2), wherein the device (1) determines and records a plurality of measurement variables Mj, j ? {1, . . . , L}, from which at least one variable G can be determined, wherein a second program portion (18) is linked to the detector (11) of the camera (10), said program portion calculating an analysis of the measurement variables Mj with regard to a possible incorrect measurement.

Abstract: A measuring apparatus for determining relative positions of a positioning stage arranged in a moveable fashion in at least one direction by a predeterminable maximum traversing path. The measuring device comprises at least one interferometric measuring means and at least one interferometric correction means. An interferometric measuring means is operable with the laser light of a laser of at least one wavelength. Correction results can be generated with the interferometric correction means allowing conclusions to be drawn with respect to the actual wavelength of the laser light during a position determination of the positioning stage in order to take into account variations of the wavelength of the laser light, in particular due to ambient conditions, when evaluating the measuring results. The interferometric correction means is arranged proximate to the interferometric measuring means, and the proximity corresponds to a predeterminable portion of the maximum traversing path of the positioning stage.

Abstract: A dual-mode electron beam lithography machine (10) comprises an electron beam column (11) for generating an electron beam (12) for writing a pattern on a surface of a substrate 14) by way of a writing current, the substrate being supported on a stage (13) movable to displace the substrate relative to the beam. The column (10) includes beam deflecting plates (16) for deflecting the beam to scan the substrate surface in accordance with the pattern to be written and beam blanking plates (15) for blanking the beam to interrupt writing. The machine further comprises control means (17 to 20) for changing each of writing current, stage movement, beam deflection and beam blanking between a predetermined first mode optimised for pattern-writing accuracy, thus resolution, and a predetermined second mode different from the first mode and optimised for pattern-writing speed, thus throughput.

Abstract: A dual-mode electron beam lithography machine (10) comprises an electron beam column (11) for generating an electron beam (12) for writing a pattern on a surface of a substrate 14) by way of a writing current, the substrate being supported on a stage (13) movable to displace the substrate relative to the beam. The column (10) includes beam deflecting plates (16) for deflecting the beam to scan the substrate surface in accordance with the pattern to be written and beam blanking plates (15) for blanking the beam to interrupt writing. The machine further comprises control means (17 to 20) for changing each of writing current, stage movement, beam deflection and beam blanking between a predetermined first mode optimised for pattern-writing accuracy, thus resolution, and a predetermined second mode different from the first mode and optimised for pattern-writing speed, thus throughput.