Abstract: A coplanar waveguide, which has parallel conductor strips that are arranged on a substrate and have an electrically insulating intermediate space between one another, wherein a material with a high dielectric constant is arranged on the conductor strips, on their side facing away from the substrate. In this way, it is possible to achieve a line section with a relatively small characteristic impedance.

Abstract: The invention relates to an electric or opto-electric component (1, 11) with a packaging (2, 12) of plastic, at least one electric or opto-electric integrated circuit (3, 13) arranged in the packaging (2, 12) and terminal leads (4, 14) protruding from the packaging (2, 12) for connection of the circuit or each circuit (3, 13). To reduce the impedance (Z) of the terminal leads (4, 14) in the simplest possible way, it is proposed that at least one dielectric plate (6, 16′, 16″) is attached to at least one of the terminal leads (4, 14). The dielectric plates (6, 16) are arranged preferably in the inside of the packaging (2, 12) and consist preferably of ceramic, in particular of aluminium oxide.

Abstract: Electronic components, in particular opto-electronic components, are conventionally mounted onto a submount, on the surface of which there are located contact areas for the electrical contacting of the components. A so-called crosstalk may arise between two components. This interference effect clearly reduces the signal/interference ratio of the message signals and hence the performance of the assembly. Here it is proposed to introduce into the submount (1), at least beneath the point at which the first contact area (5) is located, a depression (8) which is provided with a metal film (6a) and filled with a dielectric, the metal film (6a) being electrically connected to the second, opposite-pole contact area (6). Hence the field lines are concentrated in the depression which is filled with the dielectric, whereby the metal film which is applied there shields the material of the submount against penetration of the field lines.

Abstract: A coplanar waveguide, which has parallel conductor strips that are arranged on a substrate and have an electrically insulating intermediate space between one another, wherein a material with a high dielectric constant is arranged on the conductor strips, on their side facing away from the substrate. In this way, it is possible to achieve a line section with a relatively small characteristic impedance.

Abstract: The invention relates to an electric or opto-electric component (1, 11) with a packaging (2, 12) of plastic, at least one electric or opto-electric integrated circuit (3, 13) arranged in the packaging (2, 12) and terminal leads (4, 14) protruding from the packaging (2, 12) for connection of the circuit or each circuit (3, 13). To reduce the impedance (Z) of the terminal leads (4, 14) in the simplest possible way, it is proposed that at least one dielectric plate (6, 16′, 16″) is attached to at least one of the terminal leads (4, 14). The dielectric plates (6, 16) are arranged preferably in the inside of the packaging (2, 12) and consist preferably of ceramic, in particular of aluminium oxide.

Abstract: Electronic components, in particular opto-electronic components, are conventionally mounted onto a submount, on the surface of which there are located contact areas for the electrical contacting of the components. A so-called crosstalk may arise between two components. This interference effect clearly reduces the signal/interference ratio of the message signals and hence the performance of the assembly.

Abstract: To protect the high frequency circuits arranged in a casing and which are operated at frequencies of >1 GHz to 100 GHz against inner electromagnetic perturbing radiation, the complete circuit (1) is equipped on both sides with a large area layer (3, 4) which absorbs electrical fluctuations. The layer (4), made from a material which absorbs electrical fluctuations, such as silicon with average conductivity, is arranged below the circuit carrier (1). The circuit carrier (1) with the components (5) is encapsulated by a dielectric material such as silicon sealing compound or epoxy resin. The layer (3) made from a sealing compound which absorbs electrical fluctuations, such as silicon filled with iron powder, is arranged above the encapsulated circuit carrier (1, 2).