Abstract: A crystallizing glass solder for high-temperature applications, which is free of PbO and contains, in % by weight on an oxide basis: 45% to 60% of BaO; 25% to 40% of SiO2; 5% to 15% of B2O3; 0 to <2% of Al2O3; 2 to 7.0, preferably 4.4 to 7.0%, of MgO; and at least one alkaline earth metal oxide from the group consisting of MgO, CaO and SrO, wherein CaO is 0% to 5% and the sum of the alkaline earth metal oxides MgO, CaO and SrO is 2% to 15%. Preferred embodiments of the glass solder contain from 3 to 15 wt. % of Y2O3 and have low porosity and high stability with respect to a moist fuel gas environment.

Abstract: A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to <2% of Al2O3, and at least one alkaline earth metal oxide from the group consisting of MgO, CaO and SrO, wherein CaO is 0% to 5% and the sum of the alkaline earth metal oxides MgO, CaO and SrO is 0% to 20%, preferably 2% to 15%. The glass solder is preferably free from TeO2 and PbO. Preferred embodiments of the glass solder contain from 3 to 15 wt. % of Y2O3 and have low porosity and high stability with respect to a moist fuel gas environment.

Abstract: A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to <2% of Al2O3, and at least one alkaline earth metal oxide from the group consisting of MgO, CaO and SrO, wherein CaO is 0% to 5% and the sum of the alkaline earth metal oxides MgO, CaO and SrO is 0% to 20%, preferably 2% to 15%. The glass solder is preferably free from TeO2 and PbO. Preferred embodiments of the glass solder contain from 3 to 15 wt. % of Y2O3 and have low porosity and high stability with respect to a moist fuel gas environment.

Abstract: A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body.

Abstract: A feed-through, for example a battery feed-through for a lithium-ion battery or a lithium ion accumulator, has at least one base body which has at least one opening through which at least one conductor, for example a pin-shaped conductor, embedded in a glass material is guided. The base body contains a low melting material, for example a light metal, such as aluminum, magnesium, AlSiC, an aluminum alloy, a magnesium alloy, titanium, titanium alloy or steel, in particular special steel, stainless steel or tool steel. The glass material consists of the following in mole percent: 35-50% P2O5, for example 39-48%; 0-14% Al2O3, for example 2-12%; 2-10% B2O3, for example 4-8%; 0-30% Na2O, for example 0-20%; 0-20% Li2O, for example 12-20%, wherein M is K, Cs or Rb; 0-10% PbO, for example 0-9%; 0-45% Li2O, for example 0-40% or 17-40%; 0-20% BaO, for example 5-20%; 0-10% Bi2O3, for example 1-5% or 2-5%.

Abstract: A feed-through component for a conductor feed-through which passes through a part of a housing, for example a battery housing, is embedded in a glass or glass ceramic material and has at least one conductor, for example an essentially pin-shaped conductor, and a head part. The surface, in particular the cross-sectional surface, of the head part is greater than the surface, in particular the cross-sectional surface, of the conductor, for example of the essentially pin-shaped conductor. The head part is embodied such that is can be joined to an electrode-connecting component, for example an electrode-connecting part, which may be made of copper, a copper alloy CuSiC, an aluminum alloy AlSiC or aluminum, with a mechanically stable and non-detachable connection.

Abstract: A feed-through, in particular a feed-through which passes through a housing component of a housing, for example a battery housing, such as a battery cell housing. The housing component includes at least one opening through which at least one conductor, for example an essentially pin-shaped conductor, is guided. The pin-shaped conductor is at least partially surrounded by an insulator, for example made of a glass or a glass ceramic material. The at least one conductor connection, for example of the essentially pin-shaped conductor and/or of the housing component with the insulator, which is a glass or a glass ceramic material, is formed, the connection being an ultrasonic welding.

Abstract: A glass, for example a glass solder, includes the following components in mole percent (mol-%): P2O5 37-50 mol-%, for example 39-48 mol-%; Al2O3 0-14 mol-%, for example 2-12 mol-%; B2O3 2-10 mol-%, for example 4-8 mol-%; Na2O 0-30 mol-%, for example 0-20 mol-%; M2O 0-20 mol-%, for example 12-20 mol-%, wherein M is, for example, K, Cs or Rb; Li2O 0-42 mol-%, for example 0-40 mol-% or 17-40 mol-%; BaO 0-20 mol-%, for example 0-20 mol-% or 5-20 mol-%; and Bi2O3 0-10 mol-%, for example 1-5 mol-% or 2-5 mol-%.

Abstract: A feed-through has a base body, for example in the form of a disk-shaped metal part. The base body includes at least one opening through which at least one conductor, for example an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body includes a material having a low melting point, such as a light metal, and the glass or glass ceramic material is selected in such a manner that the melting temperature thereof is lower than the melting temperature of the material of the base body.

Abstract: A glass-based material is disclosed, which is suitable for the production of a separator for an electrochemical energy accumulator, in particular for a lithium ion accumulator, wherein the glass-based material comprises at least the following constituents (in wt.-% based on oxide): SiO2+F+P2O5 20-95; Al2O3 0.5-30, wherein the density is less than 3.7 g/cm3.

Abstract: The glass-ceramic joining material, which is suitable for bonding or joining at low processing temperatures, especially less than 800° C., is composed of a BaO—SiO2—CaO—B2O3—Al2O3 system and has a coefficient of thermal expansion ?(20-300)?9.5·10?6 K?1.

Abstract: A vitreous or glass-ceramic jointing material, which has a coefficient of thermal expansion ?(20-750) of ?7·10?6 K?1 and is free of BaO and SrO except for at the most impurities and is suitable for producing joint connections between chromium-containing alloys or chromium-containing steels.

Abstract: A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to <2% of Al2O3, and at least one alkaline earth metal oxide from the group consisting of MgO, CaO and SrO, wherein CaO is 0% to 5% and the sum of the alkaline earth metal oxides MgO, CaO and SrO is 0% to 20%, preferably 2% to 15%. The glass solder is preferably free from TeO2 and PbO. Preferred embodiments of the glass solder contain from 3 to 15 wt. % of Y2O3 and have low porosity and high stability with respect to a moist fuel gas environment.

Abstract: The invention relates to a conversion material, in particular for a white or colored light source comprising a semiconductor light source as primary light source, comprising a matrix glass that, as bulk material, for a thickness d of about 1 mm, has a pure transmission ?i of greater than 80% in the wavelength region from 350 to 800 nm and in the region in which the primary light source emits light, wherein the sum of transmission and reflection of the sintered matrix glass without luminophore is at least greater than 80% in the spectral region from 350 nm to 800 nm and in the spectral region in which the primary light source emits light.

Abstract: A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to <2% of Al2O3, and at least one alkaline earth metal oxide from the group consisting of MgO, CaO and SrO, wherein CaO is 0% to 5% and the sum of the alkaline earth metal oxides MgO, CaO and SrO is 0% to 20%, preferably 2% to 15%. The glass solder is preferably free from TeO2 and PbO. Preferred embodiments of the glass solder contain from 3 to 15 wt. % of Y2O3 and have low porosity and high stability with respect to a moist fuel gas environment.

Abstract: The glass composite has a linear thermal expansion coefficient ?(20-300) of 1.8×10?6K?1 to 2.4×10?6K?1, a glass transformation temperature Tg of less than 650° C., and a composition, in weight percent based on oxide content, of: 5-9, B2O3; 1-3, Na2O; 15-22, Al2O3; 61-68, SiO2; 0.2-0.5, K2O; and 5.5-8.5, MgO. It can be made by sintering a mixture of 40 to 60 wt. % of a borosilicate glass powder and 60 to 40 wt. % of a cordierite powder. The powder mixture can be used to make a glass solder for joining parts, to make a sintered body with thermal shock resistance, or for glazing or soldering PZT ceramics.

Abstract: The invention relates to granulates, a process for the production thereof, in particular a process for the continuous production of these granulates, and use of the granulates for the manufacture of green compacts or compacts and further processing thereof into corresponding products, whereby the granulates have spherical particles with a smooth or smoothed, in particular fire-polished, surface.

Abstract: The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO2; 5-10, B2O3; 4.5-12, ZnO; 79-88, Bi2O3; 0.0, CeO2; and 0.6-2, Al2O3, and a weight ratio of SiO2 to Al2O3 of <2. The solder glass preferably contains from 80.5 to 85 wt. % of Bi2O3 and is free of lead. This solder glass has a linear thermal expansion coefficient ?(20-300) of <11.5×10?6/K and a transformation temperature Tg of <380° C. A solder glass preparation for connecting or sealing a glass part with a metal part contains the low melting solder glass and up to 20 wt. % of ?-eucryptite, cordierite, mullite, willemite or zircon.

Abstract: The glass composite has a linear thermal expansion coefficient ?(20-300) of 1.8×10?6K?1 to 2.4×10?6K?1, a glass transformation temperature Tg of less than 650° C., and a composition, in weight percent based on oxide content, of: 5-9, B2O3; 1-3, Na2O; 15-22, Al2O3; 61-68, SiO2; 0.2-0.5, K2O; and 5.5-8.5, MgO. It can be made by sintering a mixture of 40 to 60 wt. % of a borosilicate glass powder and 60 to 40 wt. % of a cordierite powder. The powder mixture can be used to make a glass solder for joining parts, to make a sintered body with thermal shock resistance, or for glazing or soldering PZT ceramics.

Abstract: The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO2; 5-10, B2O3; 4.5-12, ZnO; 79-88, Bi2O3; and 0.6-2, Al2O3, and a weight ratio of SiO2 to Al2O3 of <2. The solder glass preferably contains from 80.5 to 85 wt. % of Bi2O3 and is free of lead. This solder glass has a linear thermal expansion coefficient ?(20-300) of <11.5×10?6/K and a transformation temperature Tg of <380° C. A solder glass preparation for connecting or sealing a glass part with a metal part contains the low melting solder glass and up to 20 wt. % of ?-eukryptite, cordierite, mullite, willemite or zircon.