Abstract: The present disclosure relates to methods and apparatus for an atomic layer deposition (ALD) processing chamber for device fabrication and methods for replacing a gas distribution plate and mask of the same. The ALD processing chamber has a slit valve configured to allow removal and replacement of a gas distribution plate and mask. The ALD processing chamber may also have actuators operable to move the gas distribution plate to and from a process position and a substrate support assembly operable to move the mask to and from a process position.

Abstract: In one implementation, an integrated processing tool for the deposition and processing of lithium metal in energy storage devices. The integrated processing tool may be a web tool. The integrated processing tool may comprises a reel-to-reel system for transporting a continuous sheet of material through the following chambers: a chamber for depositing a thin film of lithium metal on the continuous sheet of material and a chamber for depositing a protective film on the surface of the thin film of lithium metal. The chamber for depositing a thin film of lithium metal may include a PVD system, such as an electron-beam evaporator, a thin film transfer system, or a slot-die deposition system. The chamber for depositing a protective film on the lithium metal film may include a chamber for depositing an interleaf film or a chamber for depositing a lithium-ion conducting polymer on the lithium metal film.

Abstract: A shadow mask (200) includes a frame (210) made of a metallic material, and one or more mask patterns (205) coupled to the frame (210), the one or more mask patterns (205) comprising a metallic material having a coefficient of thermal expansion less than or equal to about 14 microns/meter/degrees Celsius and having a plurality of openings (215) formed therein, the metallic material having a thickness of about 5 microns to about 50 microns and having a pitch tolerance between openings (215) of about +/?3 microns across a length of about 160 millimeters.

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

Abstract: A holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber is provided. The holding arrangement includes two or more alignment actuators connectable to at least one of the substrate carrier and the mask carrier, wherein the holding arrangement is configured to support the substrate carrier in, or parallel to, a first plane, wherein a first alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in a first direction, wherein a second alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in the first direction and a second direction different from the first direction, and wherein the first direction and the second direction are in the first plane.

Abstract: A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

Abstract: A processing apparatus for processing devices, particularly devices including organic materials therein, is described. The processing apparatus includes a processing vacuum chamber; at least one evaporation source for organic material, wherein the at least one evaporation source includes at least one evaporation crucible, wherein the at least one evaporation crucible is configured to evaporate the organic material, and at least one distribution pipe with one or more outlets, wherein the at least one distribution pipe is in fluid communication with the at least one evaporation crucible; and a maintenance vacuum chamber connected with the processing vacuum chamber, wherein the at least one evaporation source can be transferred from the processing vacuum chamber to the maintenance vacuum chamber and from the maintenance vacuum chamber to the processing vacuum chamber.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: The present disclosure relates to methods and apparatus for an atomic layer deposition (ALD) processing chamber for device fabrication and methods for replacing a gas distribution plate and mask of the same. The ALD processing chamber has a slit valve configured to allow removal and replacement of a gas distribution plate and mask. The ALD processing chamber may also have actuators operable to move the gas distribution plate to and from a process position and a substrate support assembly operable to move the mask to and from a process position.

Abstract: The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). A process kit for TFE is provided. The process kit is an assembly including a window, a mask parallel to the window, and a frame. The process kit further includes an inlet channel for flowing process gases into the volume between the window and the mask, an outlet channel for pumping effluent gases away from the volume between the window and the mask, and seals for inhibiting the flow of process gases and effluent gases to undesired locations. A method of performing TFE is provided, including placing a substrate under the mask of the above described process kit, flowing process gases into the process kit, and activating some of the process gases into reactive species by means of an energy source within a processing chamber.

Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

Abstract: Methods of and factories for thin-film battery manufacturing are described. A method includes operations for fabricating a thin-film battery. A factory includes one or more tool sets for fabricating a thin-film battery.

Abstract: Embodiments of a portable electrostatic chuck for use in a substrate process chamber to support an ultra-thin substrate when disposed thereon are provided herein. In some embodiments, a portable electrostatic chuck may include a carrier comprising a dielectric material; an electrically conductive layer disposed on a top surface of the carrier; a dielectric layer disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and at least one conductor coupled to the electrically conductive layer, wherein the portable electrostatic chuck is configured to electrostatically retain the ultra-thin substrate to the portable electrostatic chuck, wherein the portable electrostatic chuck is further configured to be handled and moved by substrate processing equipment outside of the substrate process chamber, and wherein the portable electrostatic chuck is sized to support large ultra-thin substrates.

Abstract: Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.

Abstract: The embodiments described herein generally relate to active alignment of a fine metal mask. The fine metal mask is connected with a frame through a plurality of microactuators. The microactuators can act on the fine metal mask to stretch the mask, reposition the mask or both. In this way, the position and size of the fine metal mask can be maintained in relation to the substrate.

Abstract: A method and apparatus for depositing a multilayer barrier structure is disclosed herein. In one embodiment, a thin barrier layer formed over an organic semiconductor includes a non-conformal organic layer, an inorganic layer formed over the non-conformal organic layer, a metallic layer formed over the inorganic layer and a second organic layer formed over the metallic layer. In another embodiment, a method of depositing a barrier layer includes forming an organic semiconductor device over the exposed surface of a substrate, depositing an inorganic layer using CVD, depositing a metallic layer comprising one or more metal oxide or metal nitride layers over the inorganic layer by ALD, each of the metal oxide or metal nitride layers comprising a metal, wherein the metal is selected from the group consisting of aluminum, hafnium, titanium, zirconium, silicon or combinations thereof and depositing an organic layer over the metallic layer.

Abstract: In some embodiments, a gas distribution system may include a body disposed within a through hole formed in a process chamber body, the body comprising an opening, wherein an outer surface of the body is disposed a first distance from an inner surface of the through hole to form a first gap; a flange disposed proximate a first end of the body, the flange having an outer dimension greater than an inner dimension of the through hole; a showerhead disposed proximate a second end of the body opposite the first end and extending outwardly from the body to overlap a portion of the process chamber body, the showerhead configured to allow a flow of gas to an inner volume of the process chamber, wherein an outer surface of the showerhead is disposed a second distance from an inner surface of the process chamber body to form a second gap.

Abstract: Methods of and hybrid factories for thin-film battery manufacturing are described. A method includes operations for fabricating a thin-film battery. A hybrid factory includes one or more tool sets for fabricating a thin-film battery.