Abstract: In rotors for electric motors, it is usual to fix the commutator on the rotor shaft by means of a press fit. In the present invention, the rotor shaft, with the rotor core fixed thereon, is electronically coated with an epoxy layer on opposite portions of the rotor shaft and in the winding slots, and is then heated on the plasticizing and curing temperature of the epoxy. After that, with the help of a sliding temperature, the commutator, whose inner bore has a clearance fit relative to the rotor shaft, is slipped onto the rotor shaft in a terminal position, in the process the still-viscous epoxy is pushed backward and is deposited radially on a connecting end face, forming a bead, and penetrates the annular gap between the inner bore and the rotor shaft. Once the epoxy layer has cooled, the commutator is fixed against rotation and displacement on the rotor shaft. The rotor is suitable for electric motors of various types.

Abstract: In rotors for electric motors, it is usual to fix the commutator on the rotor shaft by means of a press fit. In the process, damage undesirably occurs to the surface of the rotor shaft.

Abstract: In rotors for electric motors, it is usual to fix the commutator on the rotor shaft by a press fit. In the present invention, the rotor shaft, with the rotor core fixed thereon, is electrostatically coated with an epoxy layer on opposite portions of the rotor shaft and in the winding slots, and is then heated to the plasticizing and curing temperature of the epoxy. After that, by a sliding tool, the commutator, whose inner bore has a clearance fit relative to the rotor shaft, is slipped onto the rotor shaft in a terminal position, in the process the still-viscous epoxy is pushed backward and is deposited radially on a connecting end face, forming a bead, and penetrates the annular gap between the inner bore and the rotor shaft. Once the epoxy layer has cooled, the commutator is fixed against rotation and displacement on the rotor shaft. The rotor is suitable for electric motors of various types.

Abstract: Disclosed is a vacuum reactor for etching substrates having a low thermal conductivity to a high degree of etch rate uniformity, wherein the substrates to be etched are arranged in a holder at a predetermined spacing from the cathode to which RF energy is applied. According to a preferred embodiment of the invention, the cathode is raised in the area of the substrate to be etched to within a spacing of about 0.2 mm from the bottom side of the substrate. The cathode is made of aluminium, and is provided in the area of the substrate to be etched with a layer which acts as a black radiator. The heat formed during RIE is removed by radiation, and the radiation reflected from the cathode to the substrate is absorbed by the layer. Also disclosed is a method of etching substrates having a low thermal conductivity, in particular plastic substrates.

Abstract: Disclosed is a vacuum reactor for etching substrates having a low thermal conductivity to a high degree of etch rate uniformity, wherein the substrates to be etched are arranged in a holder at a predetermined spacing from the cathode to which RF energy is applied. According to a preferred embodiment of the invention, the cathode is raised in the area of the substrate to be etched to within a spacing of about 0.2 mm from the bottom side of the substrate. The cathode is made of aluminium, and is provided in the area of the substrate to be etched with a layer which acts as a black radiator. The heat formed during RIE is removed by radiation, and the radiation reflected from the cathode to the substrate is absorbed by the layer. Also disclosed is a method of etching substrates having a low thermal conductivity, in particular plastic substrates.