Patents by Inventor Dieter KNÖCHEL

Dieter KNÖCHEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a composite material
    Patent number: 10448504
    Abstract: A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 ?m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: October 15, 2019
    Assignee: ROGERS GERMANY GMBH
    Inventors: Andreas Meyer, Stefan Britting, Dieter Knöchel, David Bierwagen
  • METHOD FOR PRODUCING A COMPOSITE MATERIAL
    Publication number: 20180213639
    Abstract: A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterised by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 ?m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer and connecting the base material to the at least one additional layer.
    Type: Application
    Filed: May 13, 2016
    Publication date: July 26, 2018
    Applicant: Rogers Germany GmbH
    Inventors: Andreas MEYER, Stefan BRITTING, Dieter KNÖCHEL, David BIERWAGEN