Patents by Inventor Dieter Lachman

Dieter Lachman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with semiconductor device components embedded in a plastic housing composition
    Patent number: 7705472
    Abstract: A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 27, 2010
    Assignee: Infineon Technologies, AG
    Inventors: Joachim Mahler, Ralf Wombacher, Dieter Lachman, Bernd Betz, Stefan Paulus, Edmund Riedl
  • Semiconductor Device with Semiconductor Device Components Embedded in a Plastic Housing Composition
    Publication number: 20070145606
    Abstract: A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.
    Type: Application
    Filed: December 19, 2006
    Publication date: June 28, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Ralf Wombacher, Dieter Lachman, Bernd Betz, Stefan Paulus, Edmund Riedl