Patents by Inventor Dieter Maier-Schneider

Dieter Maier-Schneider has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micromechanical, capacitative ultrasound transducer and method for the manufacture thereof
    Patent number: 6426582
    Abstract: A micromechanical, capacitative ultrasound transducer having a planar membrane is adapted such for manufacturing an air gap between membrane and cooperating electrode that the membrane collapses. The width of the air gap is thereby defined by nubs located on the membrane that lie against the cooperating electrode.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: July 30, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventors: Kurt Niederer, Peter-Christian Eccardt, Dieter Maier-Schneider
  • Micromechanical component protected from environmental influences
    Patent number: 6401544
    Abstract: A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: June 11, 2002
    Assignee: Infineon Technologies AG
    Inventors: Robert Aigner, Christofer Hierold, Hergen Kapels, Stefan Kolb, Dieter Maier-Schneider, Klaus-Günter Oppermann, Hans-Jörg Timme, Thomas Scheiter, Wolfgang Werner
  • Micromechanical structure, sensor and method for manufacturing the same
    Patent number: 6373115
    Abstract: A micromechanical structure, such as a sensor, includes a substrate, a diaphragm, a cavity, a sacrificial layer and a terminating structure. The terminating structure is cut away in the region of the diaphragm in such a way that a media opening is located above the diaphragm. The diameter of the cavity is smaller over the entire circumference of the cavity than the diameter of the opening. A method for manufacturing the micromechanical structure is also provided.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: April 16, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stefan Kolb, Dieter Maier-Schneider, Klaus-Günter Oppermann, Hans-Jörg Timme
  • Micromechanical component protected from environmental influences
    Publication number: 20010054315
    Abstract: A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.
    Type: Application
    Filed: February 27, 2001
    Publication date: December 27, 2001
    Inventors: Robert Aigner, Christofer Hierold, Hergen Kapels, Stefan Kolb, Dieter Maier-Schneider, Klaus-Gunter Oppermann, Hans-Jorg Timme, Thomas Scheiter, Wolfgang Werner