Abstract: A multichip module having a carrier substrate, on whose component side an IC component and other electronic components are mounted which are interconnected by way of electrically conductive interconnects. Electrical through-lines are led from the component side to the bottom side of the carrier substrate and being joined to solder contacts arranged on the bottom side for the electrical connection of the multichip module to a card cage. To reduce the density of printed circuit traces on the top side of the multichip module, and to decrease the number of layers necessary in the carrier substrate, a carrier part is arranged between an IC component and the carrier substrate, the carrier part having printed circuit traces and components which are connected to the respective IC component by way of first terminal pads, and are connected to terminals on the carrier substrate by way of second terminal pads.